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IXGH24N60B

型号：

IXGH24N60B

描述：

HiPerFAST IGBT[ HiPerFAST IGBT ]

品牌：

IXYS[ IXYS CORPORATION ]

页数：

4 页

PDF大小：

140 K

下载PDF手册
IXGH 24N60B  
VCES  
IC25  
= 600 V  
= 48 A  
HiPerFASTTM IGBT  
VCE(sat) = 2.3 V  
tfi  
= 80 ns  
PreliminaryData  
TO-247 AD  
Symbol  
TestConditions  
Maximum Ratings  
VCES  
VCGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGE = 1 MΩ  
600  
600  
V
V
VGES  
VGEM  
Continuous  
Transient  
±20  
±30  
V
V
TAB)  
G
IC25  
IC90  
ICM  
TC = 25°C  
TC = 90°C  
TC = 25°C, 1 ms  
48  
24  
96  
A
A
A
C
E
G = Gate,  
C = Collector,  
E = Emitter,  
TAB = Collector  
SSOA  
V
= 15 V, TVJ = 125°C, RG = 22 Ω  
I
= 48  
A
(RBSOA)  
CGlaE mped inductive load  
@ 0C.8M VCES  
150  
Features  
PC  
TC = 25°C  
W
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
• International standard packages  
JEDEC TO-247 SMD surface  
mountable and JEDEC TO-247 AD  
• High frequency IGBT  
• High current handling capability  
• 3rd generation HDMOSTM process  
• MOS Gate turn-on  
Maximum lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Md  
Mounting torque (M3)  
1.13/10 Nm/lb.in.  
- drive simplicity  
Weight  
6
g
Applications  
• AC motor speed control  
• DC servo and robot drives  
• DC choppers  
• Uninterruptible power supplies (UPS)  
• Switched-mode and resonant-mode  
power supplies  
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
BVCES  
VGE(th)  
I
= 250 µA, VGE = 0 V  
600  
2.5  
V
V
ICC = 250 µA, VCE = VGE  
5.5  
ICES  
VCE = 0.8 • VCES  
VGE = 0 V  
T = 25°C  
200 µA  
mA  
TJJ = 125°C  
1
Advantages  
• High power density  
• Switching speed for high frequency  
applications  
• Easy to mount with 1 screw  
(insulated mounting screw hole)  
IGES  
VCE = 0 V, VGE = ±20 V  
±100 nA  
2.3  
VCE(sat)  
IC = IC90, VGE = 15 V  
V
95584C(12/02)  
© 2002 IXYS All rights reserved  
IXGH 24N60B  
Symbol  
gfs  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
TO-247 AD Outline  
IC = IC90; V = 10 V,  
9
13  
S
Pulse test, t C≤E 300 µs, duty cycle ≤ 2 %  
P
Cies  
Coes  
Cres  
1500  
175  
40  
pF  
pF  
pF  
VCE = 25 V, VGE = 0 V, f = 1 MHz  
IC = IC90, VGE = 15 V, VCE = 0.5 VCES  
Qg  
Qge  
Qgc  
90  
11  
30  
120 nC  
15 nC  
40 nC  
e
Dim.  
Millimeter  
Min. Max.  
Inches  
Min. Max.  
A
A1  
A2  
4.7  
2.2  
2.2  
5.3  
2.54  
2.6  
.185 .209  
.087 .102  
.059 .098  
td(on)  
tri  
Eon  
td(off)  
tfi  
25  
15  
0.6  
150  
80  
ns  
ns  
mJ  
Inductive load, TJ = 25°C  
b
b1  
b2  
1.0  
1.65  
2.87  
1.4  
2.13  
3.12  
.040 .055  
.065 .084  
.113 .123  
IC = IC90, V = 15 V  
V
CE = 0.8 GVECES, RG = Roff = 10 Ω  
200 ns  
150 ns  
mJ  
C
D
E
.4  
.8  
.016 .031  
.819 .845  
.610 .640  
Remarks: Switching times may  
increase for V (Clamp) > 0.8 • VCES  
higher TJ or inCcEreased RG  
20.80 21.46  
15.75 16.26  
,
e
L
L1  
5.20  
19.81 20.32  
4.50  
5.72 0.205 0.225  
Eoff  
24N60B 0.80  
.780 .800  
.177  
td(on)  
tri  
Eon  
td(off)  
tfi  
25  
15  
0.8  
250  
100  
1.4  
ns  
ns  
mJ  
ns  
ns  
mJ  
P
3.55  
5.89  
3.65  
.140 .144  
Inductive load, TJ = 125°C  
IC = IC90, VGE = 15 V  
Q
6.40 0.232 0.252  
R
S
4.32  
6.15 BSC  
5.49  
.170 .216  
242 BSC  
VCE = 0.8 VCES, RG = Roff = 10 Ω  
Remarks: Switching times may  
TO-247 SMD Outline  
increase for V (Clamp) > 0.8 • VCES  
higher TJ or inCcEreased RG  
,
Eoff  
24N60B  
RthJC  
RthCK  
0.83 K/W  
K/W  
0.25  
1. Gate  
2. Collector  
3. Emitter  
4. Collector  
Min. Recommended Footprint (Dimensions in inches and (mm))  
Dim.  
Millimeter  
Min. Max.  
Inches  
Min. Max.  
A
A1  
A2  
4.83  
2.29  
1.91  
5.21  
2.54  
2.16  
.190  
.090  
.075  
.205  
.100  
.085  
b
b1  
1.14  
1.91  
1.40  
2.13  
.045  
.075  
.055  
.084  
C
D
0.61  
20.80  
0.80  
21.34  
.024  
.819  
.031  
.840  
E
e
15.75  
5.45  
16.13  
BSC  
.620  
.215 BSC  
.635  
L
4.90  
2.70  
2.10  
0.00  
1.90  
5.10  
2.90  
2.30  
0.10  
2.10  
.193  
.106  
.083  
.00  
.201  
.114  
.091  
.004  
.083  
L1  
L2  
L3  
L4  
.075  
ØP  
Q
3.55  
5.59  
3.65  
6.20  
.140  
.220  
.144  
.244  
R
S
4.32  
6.15  
4.83  
BSC  
.170  
.242 BSC  
.190  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecoveredbyoneormoreofthefollowingU.S.patents:  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,486,715 6,306,728B1  
5,381,025  
IXGH24N60B  
50  
40  
30  
20  
10  
0
200  
160  
120  
80  
VGE = 13V  
TJ = 125°C  
TJ = 25°C  
VGE = 15V  
VGE = 15V  
13V  
11V  
9V  
7V  
11V  
9V  
7V  
5V  
40  
5V  
0
0
2
4
6
8
10  
0
1
2
3
4
5
VCE - Volts  
VCE - Volts  
Fig. 1. Saturation Voltage Characteristics  
Fig. 2. Extended Output Characteristics  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
50  
40  
30  
20  
10  
0
IC = 48A  
TJ = 125°C  
VGE = 15V  
9V  
VGE = 15V  
13V  
11V  
7V  
IC = 24A  
IC = 12A  
5V  
25  
50  
75  
100  
125  
150  
0
1
2
3
4
5
VCE - Volts  
TJ - Degrees C  
Fig. 4. Temperature Dependence of VCE(sat)  
Fig. 3. Saturation Voltage Characteristics  
100  
80  
60  
40  
20  
0
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
V
CE = 10V  
VGE(th)  
= 3mA  
IC  
BVCES  
IC = 3mA  
TJ =125°C  
TJ = 25°C  
3
4
5
6
7
8
9
10 11 12  
-50 -25  
0
25 50 75 100 125 150  
Fig. 6. Temperature Dependence of BVDSS & VGE(th)  
Fig. 5. Admittance Curves  
© 2002 IXYS All rights reserved  
IXGH 24N60B  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
TJ = 125°C  
IC = 24A  
24N60B  
E(OFF)  
TJ = 125°C  
24N60B  
RG = 10Ω  
E(OFF)  
E(ON)  
E(ON)  
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
RG - Ohms  
IC - Amperes  
Fig. 7. Dependence of tfi and EOFF on IC.  
Fig. 8. Dependence of tfi and EOFF on RG.  
15  
12  
9
100
I
C = 24A  
VCE = 300V  
10  
TJ = 125 C  
º
RG = 10  
Ω
6
dV/dT < 5V/ns  
1
3
0
0.1  
0
20  
40  
60  
80  
100  
200  
300  
500  
600  
0
100  
400  
Qg - nanocoulombs  
VC E - Volts  
Fig. 10. Turn-off Safe Operating Area  
Fig. 9. Gate Charge  
1
0.1  
D=0.5  
D=0.2  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
Single pulse  
D = Duty Cycle  
0.01  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
Pulse Width - Seconds  
Fig. 11. Transient Thermal Resistance  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecoveredbyoneormoreofthefollowingU.S.patents:  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,486,715 6,306,728B1  
5,381,025  
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