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2SK3019EB

型号:

2SK3019EB

描述:

2.5V驱动N沟道MOSFET[ 2.5V Drive Nch MOSFET ]

品牌:

ROHM[ ROHM ]

页数:

6 页

PDF大小:

952 K

Data Sheet  
2.5V Drive Nch MOSFET  
2SK3019EB  
Structure  
Dimensions (Unit : mm)  
EMT3F  
Silicon N-channel MOSFET  
(3)  
Features  
1) High-speed switching.  
2) Low voltage drive(2.5V drive).  
3) Drive circuits can be simple.  
4) Parallel use is easy.  
(1)  
(2)  
Abbreviated symbol : KN  
Application  
Switching  
Packaging specifications  
Inner circuit  
(3)  
Package  
Taping  
TCL  
3000  
Type  
Code  
Basic ordering unit (pieces)  
2  
(1)  
2SK3019EB  
1  
(1) Gate  
(2)  
(2) Source  
(3) Drain  
1 ESD PROTECTION DIODE  
2 BODY DIODE  
Absolute maximum ratings (Ta = 25C)  
Parameter Symbol  
Drain-source voltage  
Limits  
30  
Unit  
V
VDSS  
VGSS  
ID  
Gate-source voltage  
20  
V
Continuous  
Pulsed  
100  
mA  
mA  
mW  
C  
Drain current  
*1  
*2  
IDP  
400  
Power dissipation  
PD  
150  
Channel temperature  
Tch  
Tstg  
150  
Range of storage temperature  
*1 Pw10s, Duty cycle1%  
55 to 150  
C  
*2 Each terminal mounted on a reference land.  
Thermal resistance  
Parameter  
Symbol  
Limits  
833  
Unit  
*
Channel to Ambient  
Rth (ch-a)  
C / W  
* Each terminal mounted on a reference land.  
www.rohm.com  
2011.10 - Rev.A  
© 2011 ROHM Co., Ltd. All rights reserved.  
1/5  
Data Sheet  
2SK3019EB  
Electrical characteristics (Ta = 25C)  
Parameter  
Symbol  
IGSS  
Min.  
Typ.  
-
Max.  
Unit  
A VGS=20V, VDS=0V  
ID=10A, VGS=0V  
A VDS=30V, VGS=0V  
Conditions  
Gate-source leakage  
-
1  
Drain-source breakdown voltage V(BR)DSS  
30  
-
-
1
1.5  
8
13  
-
V
Zero gate voltage drain current  
Gate threshold voltage  
IDSS  
-
-
VGS (th)  
0.8  
-
V
VDS=3V, ID=100A  
ID=10mA, VGS=4V  
ID=1mA, VGS=2.5V  
-
-
5
Static drain-source on-state  
resistance  
*
RDS (on)  
7
*
Forward transfer admittance  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
l Yfs l  
Ciss  
20  
-
-
mS VDS=3V, ID=10mA  
pF VDS=5V  
13  
9
-
Coss  
Crss  
-
-
pF VGS=0V  
-
4
-
pF f=1MHz  
td(on)  
-
15  
35  
80  
80  
-
ns VDD 5V, ID=10mA  
ns VGS=5V  
*
*
*
*
tr  
td(off)  
tf  
-
-
Turn-off delay time  
Fall time  
-
-
ns RL=500  
-
-
ns RG=10  
*Pulsed  
www.rohm.com  
© 2011 ROHM Co., Ltd. All rights reserved.  
2011.10 - Rev.A  
2/5  
Data Sheet  
2SK3019EB  
Electrical characteristics curves  
200m  
100m  
0.15  
2
1.5  
1
V
DS=3V  
V
DS=3V  
4V  
I
D
=0.1mA  
Pulsed  
3V  
Ta=25°C  
Pulsed  
Pulsed  
50m  
3.5V  
20m  
10m  
5m  
0.1  
2.5V  
2m  
1m  
Ta=125°C  
0.05  
75°C  
25°C  
25°C  
0.5  
0
2V  
0.5m  
0.2m  
0.1m  
V
GS=1.5V  
0
0
1
2
3
4
5
50 25  
0
25  
50  
75 100 125 150  
3
0
1
2
4
DRAIN-SOURCE VOLTAGE : VDS (V)  
CHANNEL TEMPERATURE : Tch (°C)  
GATE-SOURCE VOLTAGE : VGS (V)  
Fig.1 Typical output characteristics  
Fig.3 Gate threshold voltage vs.  
channel temperature  
Fig.2 Typical transfer characteristics  
15  
50  
50  
Ta=25°C  
Pulsed  
V
GS=4V  
VGS=2.5V  
Pulsed  
Pulsed  
Ta=125°C  
75°C  
Ta=125°C  
75°C  
20  
10  
5
20  
10  
5
25°C  
25°C  
25°C  
10  
5
25°C  
2
2
I
D=10mA  
1
1
I
D
=1mA  
0.5  
0.001 0.002  
0.5  
0.001 0.002  
0
0.005  
0.01  
0.02  
0.05  
0.1  
0.2  
0.5  
0.005  
0.01  
0.02  
0.05  
0.1  
0.2  
0.5  
0
5
10  
15  
20  
DRAIN CURRENT : I  
D
(A)  
DRAIN CURRENT : I  
D
(A)  
GATE-SOURCE VOLTAGE : VGS (V)  
Fig.4 Static drain-source on-state  
resistance vs. drain current (Ι)  
Fig.5 Static drain-source on-state  
resistance vs. drain current (ΙΙ)  
Fig.6 Static drain-source  
on-state resistance vs.  
gate-source voltage  
0.5  
0.2  
200m  
9
8
7
V
DS=3V  
V
GS=4V  
V
GS=0V  
Pulsed  
Pulsed  
Pulsed  
100m  
50m  
Ta=−25°C  
25°C  
0.1  
I
D
=100mA  
20m  
75°C  
6
5
4
3
2
1
0.05  
Ta=125°C  
125°C  
10m  
5m  
ID=10mA  
75°C  
25°C  
25°C  
0.02  
0.01  
2m  
1m  
0.005  
0.5m  
0.002  
0.001  
0.2m  
0.1m  
0
0.0001 0.0002  
0.0005 0.001  
0.002  
0.005  
0.01  
0.02  
0.05  
0.1  
0.2  
0.5  
50 25  
0
25  
50  
75 100 125 150  
0
0.5  
1
1.5  
DRAIN CURRENT : ID (A)  
CHANNEL TEMPERATURE : Tch (°C)  
SOURCE-DRAIN VOLTAGE : VSD (V)  
Fig.8 Forward transfer  
Fig.7 Static drain-source on-state  
resistance vs. channel  
temperature  
Fig.9 Reverse drain current vs.  
admittance vs. drain current  
source-drain voltage (Ι)  
www.rohm.com  
© 2011 ROHM Co., Ltd. All rights reserved.  
2011.10 - Rev.A  
3/5  
Data Sheet  
2SK3019EB  
1000  
500  
200m  
50  
Ta=25°C  
Ta=25°C  
Pulsed  
t
f
Ta=25°C  
f=1MH  
GS=0V  
V
DD=5V  
GS=5V  
100m  
50m  
Z
V
t
d(off)  
V
20  
10  
5
RG=10Ω  
Pulsed  
200  
100  
Ciss  
20m  
10m  
5m  
V
GS=4V  
0V  
50  
Coss  
t
r
2m  
1m  
20  
10  
5
t
d(on)  
Crss  
2
0.5m  
1
0.2m  
0.1m  
0.5  
0.1 0.2  
2
0.1 0.2  
0.5  
1
2
5
10 20 50  
100  
0.5  
1
2
5
10  
20  
50  
0
0.5  
1
1.5  
DRAIN CURRENT : ID (mA)  
DRAIN-SOURCE VOLTAGE : VDS (V)  
SOURCE-DRAIN VOLTAGE : VSD (V)  
Fig.12 Switching characteristics  
Fig.11 Typical capacitance vs.  
drain-source voltage  
Fig.10 Reverse drain current vs.  
source-drain voltage (ΙΙ)  
www.rohm.com  
© 2011 ROHM Co., Ltd. All rights reserved.  
2011.10 - Rev.A  
4/5  
Data Sheet  
2SK3019EB  
Measurement circuits  
Pulse width  
V
GS  
ID  
VDS  
90%  
50%  
10%  
50%  
V
GS  
DS  
RL  
V
10%  
10%  
90%  
D.U.T.  
VDD  
RG  
90%  
t
d(on)  
td(off)  
t
r
tf  
t
on  
toff  
Fig.1-1 Switching Time Measurement Circuit  
Fig.1-2 Switching Waveforms  
Notice  
This product might cause chip aging and breakdown under the large electrified environment.  
Please consider to design ESD protection circuit.  
www.rohm.com  
© 2011 ROHM Co., Ltd. All rights reserved.  
2011.10 - Rev.A  
5/5  
Notice  
N o t e s  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact us.  
ROHM Customer Support System  
http://www.rohm.com/contact/  
www.rohm.com  
© 2011 ROHM Co., Ltd. All rights reserved.  
R1120A  
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