2SK3469-01MR
Super FAP-G Series
Features
FUJI POWER MOSFET200303
N-CHANNEL SILICON POWER MOSFET
Outline Drawings [mm]
TO-220F
High speed switching
Low on-resistance
No secondary breadown
Low driving power
Avalanche-proof
Applications
Switching regulators
UPS (Uninterruptible Power Supply)
DC-DCconverters
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25°C unless otherwise specified)
Item
Symbol
VDS
Ratings
500
Unit
V
Drain-source voltage
Continuous drain current
Pulsed drain current
Gate-source voltage
Repetitive or non-repetitive
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Max. power dissipation
A
ID
±14
±56
±30
14
Equivalent circuit schematic
A
ID(puls]
VGS
V
A
IAR *2
Drain(D)
mJ
kV/µs
kV/µs
W
EAS*1
188.2
20
dVDS/dt *4
dV/dt *3
PD Ta=25
Tc=25
Tch
5
°C
°C
2.16
Gate(G)
70
+150
Source(S)
Operating and storage
temperature range
Isolation Voltage
°C
-55 to +150
2
Tstg
°C
VISO *5
kVrms
<
*1 L=1.76mH, Vcc=50V, See to Avalanche Energy Graph *2 Tch=150°C
<
<
<
<
*3 IF=-ID, -di/dt=50A/µs, Vcc=BVDSS, Tch=150°C *4 VDS= 500V *5 t=60sec, f=60Hz
Electrical characteristics (Tc =25°C unless otherwise specified)
Min.
Typ.
Max. Units
Symbol
V(BR)DSS
VGS(th)
Item
Test Conditions
V
Drain-source breakdown voltaget
Gate threshold voltage
µ
ID=250 A
VGS=0V
500
V
µ
ID= 250 A
VDS=VGS
3.0
5.0
µA
25
VDS=500V VGS=0V
VDS=400V VGS=0V
Tch=25°C
Zero gate voltage drain current
IDSS
Tch=125°C
250
IGSS
RDS(on)
gfs
nA
Gate-source leakage current
Drain-source on-state resistance
Forward transcondutance
Input capacitance
VGS=±30V
VDS=0V
10
100
ID=6A VGS=10V
ID=6A VDS=25V
VDS=25V
Ω
S
0.40
0.52
5.5
11
1200
140
Ciss
pF
1800
210
9.0
Coss
Crss
td(on)
tr
Output capacitance
VGS=0V
Reverse transfer capacitance
Turn-on time ton
6.0
f=1MHz
VCC=300V ID=6A
ns
17
15
34
7
26
23
51
11
VGS=10V
td(off)
tf
Turn-off time toff
RGS=10 Ω
QG
nC
Total Gate Charge
30
10
11
45
15
16.5
VCC=250V
ID=12A
QGS
QGD
IAV
Gate-Source Charge
Gate-Drain Charge
VGS=10V
14
A
Avalanche capability
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
L=1.76mH Tch=25°C
VSD
trr
Qrr
1.00
1.50
V
IF=12A VGS=0V Tch=25°C
IF=12A VGS=0V
-di/dt=100A/µs
0.7
4.5
µs
µC
Tch=25°C
Thermalcharacteristics
Item
Symbol
Test Conditions
Min.
Typ.
Max. Units
Rth(ch-c)
channel to case
1.79
°C/W
Thermal resistance
Rth(ch-a)
channel to ambient
58.0
°C/W
1