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2SK3469-01MR_03

型号:

2SK3469-01MR_03

描述:

N沟道硅功率MOSFET[ N-CHANNEL SILICON POWER MOSFET ]

品牌:

FUJI[ FUJI ELECTRIC ]

页数:

4 页

PDF大小:

110 K

2SK3469-01MR  
Super FAP-G Series  
Features  
FUJI POWER MOSFET200303  
N-CHANNEL SILICON POWER MOSFET  
Outline Drawings [mm]  
TO-220F  
High speed switching  
Low on-resistance  
No secondary breadown  
Low driving power  
Avalanche-proof  
Applications  
Switching regulators  
UPS (Uninterruptible Power Supply)  
DC-DCconverters  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Item  
Symbol  
VDS  
Ratings  
500  
Unit  
V
Drain-source voltage  
Continuous drain current  
Pulsed drain current  
Gate-source voltage  
Repetitive or non-repetitive  
Maximum Avalanche Energy  
Maximum Drain-Source dV/dt  
Peak Diode Recovery dV/dt  
Max. power dissipation  
A
ID  
±14  
±56  
±30  
14  
Equivalent circuit schematic  
A
ID(puls]  
VGS  
V
A
IAR *2  
Drain(D)  
mJ  
kV/µs  
kV/µs  
W
EAS*1  
188.2  
20  
dVDS/dt *4  
dV/dt *3  
PD Ta=25  
Tc=25  
Tch  
5
°C  
°C  
2.16  
Gate(G)  
70  
+150  
Source(S)  
Operating and storage  
temperature range  
Isolation Voltage  
°C  
-55 to +150  
2
Tstg  
°C  
VISO *5  
kVrms  
<
*1 L=1.76mH, Vcc=50V, See to Avalanche Energy Graph *2 Tch=150°C  
<
<
<
<
*3 IF=-ID, -di/dt=50A/µs, Vcc=BVDSS, Tch=150°C *4 VDS= 500V *5 t=60sec, f=60Hz  
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Symbol  
V(BR)DSS  
VGS(th)  
Item  
Test Conditions  
V
Drain-source breakdown voltaget  
Gate threshold voltage  
µ
ID=250 A  
VGS=0V  
500  
V
µ
ID= 250 A  
VDS=VGS  
3.0  
5.0  
µA  
25  
VDS=500V VGS=0V  
VDS=400V VGS=0V  
Tch=25°C  
Zero gate voltage drain current  
IDSS  
Tch=125°C  
250  
IGSS  
RDS(on)  
gfs  
nA  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
VGS=±30V  
VDS=0V  
10  
100  
ID=6A VGS=10V  
ID=6A VDS=25V  
VDS=25V  
S
0.40  
0.52  
5.5  
11  
1200  
140  
Ciss  
pF  
1800  
210  
9.0  
Coss  
Crss  
td(on)  
tr  
Output capacitance  
VGS=0V  
Reverse transfer capacitance  
Turn-on time ton  
6.0  
f=1MHz  
VCC=300V ID=6A  
ns  
17  
15  
34  
7
26  
23  
51  
11  
VGS=10V  
td(off)  
tf  
Turn-off time toff  
RGS=10  
QG  
nC  
Total Gate Charge  
30  
10  
11  
45  
15  
16.5  
VCC=250V  
ID=12A  
QGS  
QGD  
IAV  
Gate-Source Charge  
Gate-Drain Charge  
VGS=10V  
14  
A
Avalanche capability  
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
L=1.76mH Tch=25°C  
VSD  
trr  
Qrr  
1.00  
1.50  
V
IF=12A VGS=0V Tch=25°C  
IF=12A VGS=0V  
-di/dt=100A/µs  
0.7  
4.5  
µs  
µC  
Tch=25°C  
Thermalcharacteristics  
Item  
Symbol  
Test Conditions  
Min.  
Typ.  
Max. Units  
Rth(ch-c)  
channel to case  
1.79  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
58.0  
°C/W  
1
2SK3469-01MR  
FUJI POWER MOSFET  
Characteristics  
Maximum Avalanche Energy vs. starting Tch  
EAS=f(starting Tch):Vcc=50V  
Allowable Power Dissipation  
PD=f(Tc)  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
80  
70  
60  
50  
40  
30  
20  
10  
0
IAS=6A  
IAS=9A  
IAS=14A  
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
starting Tch [°C]  
Tc [°C]  
Typical Transfer Characteristic  
ID=f(VGS):80µs Pulse test, VDS=25V,Tch=25°C  
Typical Output Characteristics  
ID=f(VDS):80µs Pulse test,Tch=25°C  
30  
20V  
10V  
8V  
28  
26  
24  
22  
20  
18  
16  
14  
12  
10  
8
10  
7.5V  
7.0V  
1
VGS=6.5V  
6
4
0.1  
2
0
0
1
2
3
4
5
6
7
8
9
10  
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30  
VDS [V]  
VGS[V]  
Typical Drain-Source on-state Resistance  
Typical Transconductance  
gfs=f(ID):80µs Pulse test, VDS=25V,Tch=25°C  
RDS(on)=f(ID):80µs Pulse test, Tch=25°C  
100  
10  
1
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
VGS=6.5V  
7.0V  
7.5V  
10V  
20V  
8V  
0.1  
0.1  
1
10  
0
5
10  
15  
20  
25  
30  
ID [A]  
ID [A]  
2
2SK3469-01MR  
FUJI POWER MOSFET  
Gate Threshold Voltage vs. Tch  
Drain-Source On-state Resistance  
VGS(th)=f(Tch):VDS=VGS,ID=250uA  
RDS(on)=f(Tch):ID=6A,VGS=10V  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
max.  
min.  
max.  
typ.  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Tch [°C]  
Tch [°C]  
Typical Capacitance  
C=f(VDS):VGS=0V,f=1MHz  
Typical Gate Charge Characteristics  
VGS=f(Qg):ID=12A, Tch=25°C  
24  
22  
20  
18  
16  
14  
12  
10  
8
10n  
Vcc= 120V  
Ciss  
1n  
100p  
10p  
1p  
300V  
480V  
Coss  
Crss  
6
4
2
0
10-1  
100  
101  
102  
103  
0
10  
20  
30  
40  
50  
60  
70  
80  
Qg [nC]  
VDS [V]  
Typical Switching Characteristics vs. ID  
Typical Forward Characteristics of Reverse Diode  
t=f(ID):Vcc=300V, VGS=10V, RG=10  
IF=f(VSD):80µs Pulse test,Tch=25°C  
100  
102  
tr  
td(off)  
10  
td(on)  
tf  
101  
1
100  
0.1  
100  
101  
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00  
VSD [V]  
ID [A]  
3
2SK3469-01MR  
FUJI POWER MOSFET  
Maximum Transient Thermal Impedance  
Zth(ch-c)=f(t):D=0  
101  
100  
10-1  
10-2  
10-3  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
t [sec]  
Maximum Avalanche Current vs Pulse width  
IAV=f(tAV):starting Tch=25°C,Vcc=50V  
102  
Single Pulse  
101  
100  
10-1  
10-2  
10-8  
10-7  
10-6  
10-5  
10-4  
10-3  
10-2  
tAV [sec]  
http://www.fujielectric.co.jp/denshi/scd/  
4
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