2SK3537-01MR
FUJI POWER MOSFET
200304
N-CHANNEL SILICON POWER MOSFET
Outline Drawings [mm]
Super FAP-G Series
TO-220F
Features
High speed switching
Low on-resistance
No secondary breadown
Low driving power
Avalanche-proof
Applications
Switching regulators
UPS (Uninterruptible Power Supply)
DC-DCconverters
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25°C unless otherwise specified)
Item
Symbol
VDS
Ratings
150
Unit
V
Drain-source voltage
VDSX *5
ID
130
±33
±132
±20
33
V
Continuous drain current
Pulsed drain current
A
Equivalent circuit schematic
ID(puls]
VGS
A
Gate-source voltage
V
Repetitive or non-repetitive
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Max. power dissipation
IAR *2
Drain(D)
A
EAS*1
169
20
mJ
kV/µs
kV/µs
W
dVDS/dt *4
dV/dt *3
PD Ta=25
Tc=25
Tch
5
°C
°C
2.16
Gate(G)
53
+150
-55 to +150
Source(S)
Operating and storage
temperature range
°C
°C
Tstg
<
*1 L=0.228mH, Vcc=48V,Tch=25°C, See to Avalanche Energy Graph *2 Tch=150°C
<
<
<
<
*4 VDS 150V *5 VGS=-20V
*3 IF=-ID, -di/dt=50A/µs, Vcc=BVDSS, Tch=150°C
=
Electrical characteristics (Tc =25°C unless otherwise specified)
Min.
Typ.
Max. Units
Symbol
V(BR)DSS
VGS(th)
Item
Test Conditions
V
Drain-source breakdown voltaget
Gate threshold voltage
µ
150
ID=250 A
VGS=0V
VDS=VGS
V
µ
1.0
2.5
ID= 250 A
µA
VDS=150V VGS=0V
VDS=120V VGS=0V
25
250
100
90
Tch=25°C
Zero gate voltage drain current
IDSS
Tch=125°C
IGSS
nA
Gate-source leakage current
VGS=±20V
ID=11.5A
10
65
VDS=0V
VGS=4V
VGS=5V
VGS=10V
RDS(on)
Drain-source on-state resistance
mΩ
60
81
54
70
gfs
ID=11.5A VDS=25V
S
12
24
Forward transcondutance
Input capacitance
Ciss
1900
200
17
2850
300
pF
VDS=75V
VGS=0V
Coss
Crss
td(on)
tr
Output capacitance
25.5
Reverse transfer capacitance
Turn-on time ton
f=1MHz
VCC=48V ID=11.5A
ns
10
15
23
VGS=10V
15
85
128
18
td(off)
tf
Turn-off time toff
RGS=10 Ω
12
46
70
QG
nC
Total Gate Charge
VCC=48V
ID=23A
8
12
QGS
QGD
IAV
Gate-Source Charge
Gate-Drain Charge
12.5
19
VGS=10V
33
A
Avalanche capability
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
µ
L=228 H Tch=25°C
1.10
1.65
VSD
trr
Qrr
V
IF=23A VGS=0V Tch=25°C
IF=23A VGS=0V
-di/dt=100A/µs
0.13
0.6
µs
µC
Tch=25°C
Thermalcharacteristics
Item
Min.
Typ.
Max. Units
Symbol
Test Conditions
Rth(ch-c)
channel to case
2.359
°C/W
Thermal resistance
Rth(ch-a)
channel to ambient
58.0
°C/W
1