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2SK3678-01_0306

型号:

2SK3678-01_0306

描述:

N沟道硅功率MOSFET[ N-CHANNEL SILICON POWER MOSFET ]

品牌:

FUJI[ FUJI ELECTRIC ]

页数:

4 页

PDF大小:

119 K

2SK3678-01  
200304  
FUJI POWER MOSFET  
N-CHANNEL SILICON POWER MOSFET  
Super FAP-G Series  
Outline Drawings [mm]  
TO-220AB  
Features  
High speed switching  
Low on-resistance  
No secondary breadown  
Low driving power  
Avalanche-proof  
Applications  
Switching regulators  
UPS (Uninterruptible Power Supply)  
DC-DCconverters  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Item  
Drain-source voltage  
Symbol  
VDS  
Ratings  
Unit  
V
900  
900  
±9  
VDSX *5  
ID  
V
A
Equivalent circuit schematic  
Continuous drain current  
Pulsed drain current  
ID(puls]  
VGS  
IAR  
±36  
±30  
9
A
Drain(D)  
Gate-source voltage  
V
Repetitive or non-repetitive  
Maximum Avalanche Energy  
Maximum Drain-Source dV/dt  
Peak Diode Recovery dV/dt  
Max. power dissipation  
*2  
*1  
A
EAS  
287.7  
40  
mJ  
dVDS/dt *4  
dV/dt  
kV/µs  
Gate(G)  
*3  
5
kV/µs  
W
°C  
°C  
PD Ta=25  
Tc=25  
Tch  
2.02  
270  
Source(S)  
Operating and storage  
temperature range  
+150  
°C  
°C  
-55 to +150  
Tstg  
<
*1 L=6.51mH, Vcc=90V, Tch=25°C See to Avalanche Energy Graph *2 Tch 150°C  
=
<
<
<
<
*3 IF -ID, -di/dt=50A/µs, Vcc BVDSS, Tch 150°C  
*4 VDS 900V *5 VGS=-30V  
=
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Symbol  
V(BR)DSS  
VGS(th)  
Item  
Test Conditions  
Drain-source breakdown voltaget  
Gate threshold voltage  
900  
V
µ
ID= 250 A  
VGS=0V  
3.0  
5.0  
25  
V
µ
ID= 250 A  
VDS=VGS  
µA  
VDS=900V VGS=0V  
Tch=25°C  
Zero gate voltage drain current  
IDSS  
250  
100  
VDS=720V VGS=0V  
VGS=±30V  
VDS=0V  
ID=4.5A VGS=10V  
Tch=125°C  
IGSS  
RDS(on)  
gfs  
nA  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
1.22  
1.58  
5
10  
1100  
140  
8
S
ID=4.5A VDS=25V  
Ciss  
1650  
210  
12  
pF  
VDS=25V  
VGS=0V  
Coss  
Crss  
td(on)  
tr  
Output capacitance  
Reverse transfer capacitance  
Turn-on time ton  
f=1MHz  
VCC=600V ID=4.5A  
ns  
25  
38  
12  
18  
VGS=10V  
50  
75  
td(off)  
tf  
Turn-off time toff  
RGS=10  
12  
18  
31  
46.5  
QG  
nC  
Total Gate Charge  
VCC=450V  
ID=9A  
4.5  
11  
8
QGS  
QGD  
IAV  
Gate-Source Charge  
Gate-Drain Charge  
16.5  
VGS=10V  
9
A
Avalanche capability  
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
L=6.51mH Tch=25°C  
0.90  
1.50  
VSD  
trr  
Qrr  
V
IF=9A VGS=0V Tch=25°C  
IF=9A VGS=0V  
-di/dt=100A/µs  
3.2  
µs  
µC  
15.5  
Tch=25°C  
Thermalcharacteristics  
Item  
Min.  
Typ.  
Max. Units  
Symbol  
Test Conditions  
Rth(ch-c)  
channel to case  
0.463  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
62.0  
°C/W  
1
2SK3678-01  
FUJI POWER MOSFET  
Characteristics  
Typical Output Characteristics  
ID=f(VDS):80 µs pulse test,Tch=25°C  
Allowable Power Dissipation  
PD=f(Tc)  
14  
12  
10  
8
300  
250  
200  
150  
100  
50  
10V  
8.0V  
20V  
7.0V  
6.5V  
6
6.0V  
4
VGS=5.5V  
20  
2
0
0
0
5
10  
15  
0
25  
50  
75  
100  
125  
150  
VDS [V]  
Tc [°C]  
Typical Transconductance  
gfs=f(ID):80 µs pulse test,VDS=25V,Tch=25°C  
Typical Transfer Characteristic  
ID=f(VGS):80 µs pulse test,VDS=25V,Tch=25°C  
10  
10  
1
1
0.1  
0.1  
1
10  
0
1
2
3
4
5
6
7
8
9
10  
VGS[V]  
ID [A]  
Typical Drain-Source on-state Resistance  
Drain-Source On-state Resistance  
RDS(on)=f(Tch):ID=4.5A,VGS=10V  
RDS(on)=f(ID):80 µs pulse test,Tch=25°C  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
5
4
3
2
1
0
VGS=5.5V  
6.0V  
6.5V  
7.0V  
8.0V  
10V  
20V  
max.  
typ.  
0
2
4
6
8
10  
12  
14  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Tch [°C]  
ID [A]  
2
2SK3678-01  
FUJI POWER MOSFET  
Gate Threshold Voltage vs. Tch  
Typical Gate Charge Characteristics  
VGS(th)=f(Tch):VDS=VGS,ID=250µA  
VGS=f(Qg):ID=9A,Tch=25°C  
14  
12  
10  
8
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
Vcc= 180V  
450V  
720V  
max.  
min.  
6
4
2
0
0
5
10  
15  
20  
25  
30  
35  
40  
45  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Tch [°C]  
Qg [nC]  
Typical Capacitance  
Typical Forward Characteristics of Reverse Diode  
C=f(VDS):VGS=0V,f=1MHz  
IF=f(VSD):80 µs pulse test,Tch=25°C  
101  
10  
Ciss  
100  
10-1  
10-2  
10-3  
Coss  
Crss  
1
0.1  
0.00  
100  
101  
102  
0.25  
0.50  
0.75  
1.00  
1.25  
1.50  
VSD [V]  
VDS [V]  
Maximum Avalanche Energy vs. starting Tch  
E(AS)=f(starting Tch):Vcc=90V  
IAS=4A  
Typical Switching Characteristics vs. ID  
t=f(ID):Vcc=600V,VGS=10V,RG=10 Ω  
103  
102  
101  
100  
700  
600  
500  
400  
300  
200  
100  
0
tf  
IAS=6A  
IAS=9A  
td(off)  
td(on)  
tr  
10-1  
100  
101  
0
25  
50  
75  
100  
125  
150  
starting Tch [°C]  
ID [A]  
3
2SK3678-01  
FUJI POWER MOSFET  
Maximum Avalanche Current Pulsewidth  
IAV=f(tAV):starting Tch=25°C,Vcc=90V  
102  
01  
100  
10-1  
10-2  
Single Pulse  
10-8  
10-7  
10-6  
10-5  
10-4  
10-3  
10-2  
tAV [sec]  
Maximum Transient Thermal Impedance  
Zth(ch-c)=f(t):D=0  
101  
100  
10-1  
10-2  
10-3  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
t [sec]  
http://www.fujielectric.co.jp/denshi/scd/  
4
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