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2SK3922-01

型号:

2SK3922-01

描述:

N沟道硅功率MOSFET[ N-CHANNEL SILICON POWER MOSFET ]

品牌:

FUJI[ FUJI ELECTRIC ]

页数:

4 页

PDF大小:

190 K

2SK3922-01  
FUJI POWER MOSFET  
200509  
N-CHANNEL SILICON POWER MOSFET  
Super FAP-G Series  
Features  
High speed switching  
No secondary breadown  
Avalanche-proof  
Low on-resistance  
Low driving power  
Outline Drawings [mm]  
TFP  
Applications  
Switching regulators  
DC-DC converters  
UPS (Uninterruptible Power Supply)  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Item  
Symbol  
VDS  
Ratings  
120  
Unit  
V
Remarks  
Drain-source voltage  
V
A
A
A
V
A
VGS=-30V  
VDSX  
ID  
90  
Foot Print Pattern  
Continuous drain current  
±67  
Ta=25°C Note *1  
±6.3  
±268  
±30  
Pulsed drain current  
Gate-source voltage  
Repetitive or non-repetitive  
ID(puls]  
VGS  
IAR  
Note *2  
Note *3  
Note *4  
67  
Non-repetitive  
Maximum avalanche energy  
Repetitive  
Maximum avalanche energy  
Maximum drain-source dV/dt  
Peak diode recovery dV/dt  
Maximum power dissipation  
Equivalent circuit schematic  
mJ  
EAS  
719.1  
27.0  
20  
Drain(D)  
mJ  
<
dVDS/dt  
dV/dt  
PD  
VDS 120V  
kV/μs  
kV/μs  
W
=
5
Note *5  
2.02  
°C Note*1  
°C  
Ta=25  
270  
W
Tc=25  
Gate(G)  
Operating and storage  
temperature range  
Tch  
+150  
°C  
Source(S)  
Tstg  
-55 to +150  
°C  
Note *1 Surface mounted on 1000mm2,t=1.6mm FR-4 PCB (Drain pad area:500mm2)  
<
Note *2 Tch 150°C  
=
Note *3 Starting Tch=25°C, IAS=27A, L=1.32mH, VCC=48V, RG=50Ω  
EAS limited by maximum channel temperrature and avalanche current.  
See to ‘Avalanche Energy’ graph.  
Note *4 Repetitve rating : Pulse width limited by maximum channel temperature.  
See to ‘Transient Thermal impedance’ graph.  
<
<
Note *5 IF -ID, -di/dt=50A/μs, Vcc BVDSS, Tch 150°C  
<
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Test Conditions  
Symbol  
V(BR)DSS  
VGS(th)  
Item  
μ
ID= 250 A  
VGS=0V  
Drain-source breakdown voltage  
Gate threshold voltage  
V
120  
μ
ID= 250 A  
VDS=VGS  
V
3.0  
5.0  
25  
Tch=25°C  
μA  
VDS=120V VGS=0V  
VDS=96V VGS=0V  
VGS=±30V  
VDS=0V  
Zero gate voltage drain current  
IDSS  
Tch=125°C  
250  
100  
IGSS  
RDS(on)  
gfs  
nA  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
ID=33.5A VGS=10V  
24.6  
30.0  
mΩ  
S
ID=33.5A VDS=25V  
VDS=75V  
14  
28  
1880  
360  
30  
Ciss  
2820  
540  
45  
pF  
VGS=0V  
Coss  
Crss  
td(on)  
tr  
Output capacitance  
f=1MHz  
Reverse transfer capacitance  
Turn-on time ton  
ns  
VCC=48V ID=33.5A  
20  
30  
35  
53  
VGS=10V  
td(off)  
tf  
50  
75  
Turn-off time toff  
RGS=10 Ω  
23  
35  
VCC=60V  
ID=67A  
52  
78  
QG  
nC  
Total Gate Charge  
16  
24  
QGS  
QGD  
VSD  
trr  
Gate-Source Charge  
Gate-Drain Charge  
18  
27  
VGS=10V  
1.10  
150  
0.9  
1.50  
IF=67A VGS=0V Tch=25°C  
IF=67A VGS=0V  
-di/dt=100A/μs  
V
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
ns  
μC  
Qrr  
Tch=25°C  
Thermalcharacteristics  
Item  
Symbol  
Test Conditions  
Min.  
Typ.  
Max. Units  
Rth(ch-c)  
channel to case  
0.463  
87.0  
52.0  
°C/W  
°C/W  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
channel to ambient  
Rth(ch-a) *1  
1
http://www.fujielectric.co.jp/fdt/scd/  
2SK3922-01  
FUJI POWER MOSFET  
Characteristics  
Allowable Power Dissipation  
PD=f(Tc)  
Allowable Power Dissipation  
PD=f(Tc)  
Surface mounted on  
1000mm2,t=1.6mm FR-4 PCB  
(Drain pad area : 500mm2)  
280  
240  
200  
160  
120  
80  
5
4
3
2
1
0
40  
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
Tc [°C]  
Tc [°C]  
Typical Transfer Characteristic  
ID=f(VGS):80 μs pulse test,VDS=25V,Tch=25°C  
Typical Output Characteristics  
ID=f(VDS):80 μs pulse test,Tch=25°C  
140  
120  
100  
80  
100  
10  
1
20V  
10V  
8.0V  
7.5V  
60  
7.0V  
6.5V  
40  
6.0V  
20  
VGS=5.5V  
0.1  
0
0
1
2
3
4
5
6
7
8
9
10  
0
1
2
3
4
5
6
7
VDS [V]  
VGS[V]  
Typical Drain-Source on-state Resistance  
Typical Transconductance  
RDS(on)=f(ID):80 μs pulse test,Tch=25 °C  
100 gfs=f(ID):80 μs pulse test,VDS=25V,Tch=25°C  
0.20  
VGS=5.5V  
6.5V  
6.0V  
7.0V  
7.5V  
0.16  
0.12  
0.08  
0.04  
0.00  
10  
1
10V  
20V  
0.1  
0.1  
0
20  
40  
60  
80  
100  
120  
1
10  
100  
ID [A]  
ID [A]  
2
2SK3922-01  
FUJI POWER MOSFET  
Gate Threshold Voltage vs. Tch  
Drain-Source On-state Resistance  
RDS(on)=f(Tch):ID=33.5A,VGS=10V  
VGS(th)=f(Tch):VDS=VGS,ID=250μA  
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0.00  
max.  
min.  
max.  
typ.  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Tch [°C]  
Tch [°C]  
Typical Gate Charge Characteristics  
Typical Capacitance  
VGS=f(Qg):ID=67A,Tch=25 °C  
C=f(VDS):VGS=0V,f=1MHz  
14  
12  
10  
8
Ciss  
103  
102  
101  
Vcc=60V  
Coss  
Crss  
6
4
2
0
100  
101  
102  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
Qg [nC]  
VDS [V]  
Typical Switching Characteristics vs. ID  
Typical Forward Characteristics of Reverse Diode  
t=f(ID):Vcc=48V,VGS=10V,RG=10 Ω  
IF=f(VSD):80 μs pulse test,Tch=25°C  
100  
10  
1
tf  
103  
102  
101  
100  
td(off)  
td(on)  
tr  
0.1  
10-1  
100  
101  
102  
0.00  
0.25  
0.50  
0.75  
1.00  
1.25  
1.50  
VSD [V]  
ID [A]  
3
2SK3922-01  
FUJI POWER MOSFET  
Maximum Avalanche Energy vs. starting Tch  
E(AV)=f(starting Tch):Vcc=48V,I(AV)<=67A  
Thermal Resistance vs. Drain Pad area  
t=1.6mm FR-4 PCB  
800  
700  
600  
500  
400  
300  
200  
100  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
IAS=27A  
IAS=41A  
IAS=67A  
0
25  
50  
75  
100  
125  
150  
0
1000  
2000  
3000  
4000  
5000  
Drain Pad Area [mm2]  
starting Tch [°C]  
Maximum Avalanche Current Pulsewidth  
IAV=f(tAV):starting Tch=25°C,Vcc=48V  
103  
102  
101  
100  
10-1  
Single Pulse  
10-8  
10-7  
10-6  
10-5  
10-4  
10-3  
10-2  
tAV [sec]  
Maximum Transient Thermal Impedance  
Zth(ch-c)=f(t):D=0  
101  
100  
10-1  
10-2  
10-3  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
t [sec]  
http://www.fujielectric.co.jp/fdt/scd/  
4
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