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2SK3047

型号:

2SK3047

描述:

硅N沟道功率的F- MOS FET[ Silicon N-Channel Power F-MOS FET ]

品牌:

PANASONIC[ PANASONIC ]

页数:

3 页

PDF大小:

46 K

Power F-MOS FETs  
2SK3047  
Silicon N-Channel Power F-MOS FET  
Features  
Avalanche energy capacity guaranteed: EAS > 15mJ  
unit: mm  
VGSS = ±30V guaranteed  
High-speed switching: tf = 25ns  
No secondary breakdown  
4.6±0.2  
9.9±0.3  
2.9±0.2  
φ3.2±0.1  
Applications  
Contactless relay  
Diving circuit for a solenoid  
Driving circuit for a motor  
Control equipment  
1.4±0.2  
2.6±0.1  
1.6±0.2  
Switching power supply  
0.8±0.1  
0.55±0.15  
Absolute Maximum Ratings (TC = 25°C)  
2.54±0.3  
3
5.08±0.5  
1
2
Parameter  
Symbol  
Ratings  
Unit  
V
1: Gate  
2: Drain  
Drain to Source breakdown voltage VDSS  
800  
3: Source  
TO-220D Package  
Gate to Source voltage  
DC  
Pulse  
Avalanche energy capacity  
VGSS  
ID  
±30  
V
±2  
A
Drain current  
IDP  
±4  
A
EAS*  
15  
mJ  
Allowable power  
dissipation  
TC = 25°C  
Ta = 25°C  
30  
PD  
W
2
Channel temperature  
Storage temperature  
Tch  
150  
°C  
°C  
Tstg  
55 to +150  
*
L = 5mH, IL = 2.45A, VDD = 50V, 1 pulse  
Electrical Characteristics (TC = 25°C)  
Parameter  
Symbol  
IDSS  
Conditions  
VDS = 640V, VGS = 0  
VGS = ±30V, VDS = 0  
ID = 1mA, VGS = 0  
VDS = 25V, ID = 1mA  
VGS = 10V, ID = 1A  
VDS = 25V, ID = 1A  
IDR = 2A, VGS = 0  
min  
typ  
max  
Unit  
mA  
µA  
V
Drain to Source cut-off current  
Gate to Source leakage current  
0.1  
±1  
IGSS  
Drain to Source breakdown voltage VDSS  
800  
2
Gate threshold voltage  
Vth  
5
7
V
Drain to Source ON-resistance  
Forward transfer admittance  
Diode forward voltage  
RDS(on)  
| Yfs |  
VDSF  
4.8  
1.1  
0.7  
S
1.3  
V
Input capacitance (Common Source) Ciss  
Output capacitance (Common Source) Coss  
Reverse transfer capacitance (Common Source) Crss  
350  
60  
25  
15  
20  
60  
25  
pF  
pF  
pF  
ns  
VDS = 20V, VGS = 0, f = 1MHz  
Turn-on time (delay time)  
Rise time  
td(on)  
tr  
td(off)  
tf  
VGS = 10V, ID = 1A  
ns  
Turn-off time (delay time)  
Fall time  
VDD = 200V, RL = 200Ω  
ns  
ns  
1
Power F-MOS FETs  
2SK3047  
Area of safe operation (ASO)  
PD  
Ta  
EAS  
Tj  
100  
60  
50  
40  
30  
20  
10  
0
30  
25  
20  
15  
10  
5
Non repetitive pulse  
TC=25˚C  
(1) TC=Ta  
(2) Without heat sink  
VDD=50V  
ID=2A  
30  
10  
t =10µs  
3
100µs  
1ms  
1
DC  
(1)  
0.3  
0.1  
10ms  
100ms  
0.03  
0.01  
(2)  
0
25  
1
3
10  
30  
100 300 1000  
0
20 40 60 80 100 120 140 160  
50  
75  
100 125 150 175  
(
V
)
(
)
(
)
Drain to source voltage VDS  
Ambient temperature Ta ˚C  
Junction temperature Tj ˚C  
ID  
VDS  
ID VGS  
Vth  
TC  
4
3
2
1
0
5
4
3
2
1
0
6
5
4
3
2
1
0
VDS=25V  
VDS=25V  
ID=1mA  
TC=25˚C  
VGS=15V  
10V  
7V  
6.5V  
6V  
5.5V  
5V  
0
10  
20  
30  
40  
50  
60  
0
2
4
6
8
10  
12  
0
25  
50  
75  
100 125 150  
(
V
)
(
V
)
(
)
Drain to source voltage VDS  
Gate to source voltage VGS  
Case temperature TC ˚C  
RDS(on)  
ID  
| Yfs | ID  
Ciss, Coss, Crss  
VDS  
10000  
1000  
100  
10  
12  
10  
8
2.0  
1.5  
1.0  
0.5  
0
VDS=25V  
TC=25˚C  
f=1MHz  
TC=25˚C  
Ciss  
VGS=10V  
6
15V  
Coss  
4
Crss  
2
1
0
0
50  
100  
150  
200  
0
1
2
3
4
5
0
1
2
3
4
( )  
V
( )  
A
( )  
A
Drain to source voltage VDS  
Drain current ID  
Drain current ID  
2
Power F-MOS FETs  
2SK3047  
VDS, VGS  
Qg  
td(on), tr, tf, td(off)  
ID  
800  
700  
600  
500  
400  
300  
200  
100  
0
16  
14  
12  
10  
8
120  
100  
80  
60  
40  
20  
0
VDD=200V  
VGS=10V  
TC=25˚C  
ID=2A  
TC=25˚C  
VGS  
VDS  
td(off)  
6
tf  
tr  
4
td(on)  
2
0
24  
0
4
8
12  
16  
20  
0
0.5  
1.0  
1.5  
2.0  
2.5  
(
)
( )  
Drain current ID A  
Gate charge amount Qg nC  
Rth(t)  
t
102  
10  
(1) Without heat sink  
(2) With a 100 × 100 × 2mm Al heat sink  
(1)  
(2)  
1
10–1  
10–2  
10–4  
10–3  
10–2  
10–1  
1
10  
102  
103  
104  
( )  
s
Time  
t
3
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