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BD7003NUX_11

型号:

BD7003NUX_11

描述:

CMOS LDO稳压器用于便携式设备双路,低压差线性稳压器[ CMOS LDO Regulator for Portable Equipments Dual, Low-Dropout Linear Regulator ]

品牌:

ROHM[ ROHM ]

页数:

14 页

PDF大小:

649 K

CMOS LDO Regulator for Portable Equipments  
Dual, Low-Dropout  
Linear Regulator  
No.12020ECT09  
BD7003NUX, BD7004NUX  
Descriptions  
The BD7003NUX, BD7004NUX are dual channels, 300mA low-dropout voltage regulator output at each channel. The output  
voltage range is from 1.2V to 3.3V by operating range from 2.5V to 5.5V. The output voltages, VOUT1 and VOUT2, are  
determined at power up by the state of P1 and P2(see the table of “Output-Voltage Programming”). The BD7003NUX,  
BD7004NUX offer 1.8% accuracy and low-dropout. The shutdown current is near the zero current which is suitable for  
battery powered device. The BD7003NUX, BD7004NUX are mounted on VSON008X2020(2.0mmX2.0mmX0.6mm), which  
contributes to the space-saving design of set.  
Features  
1) 2-channel 300mA, CMOS-type LDOs.  
2) Pin-Programmable Output Voltage.  
(9 steps adjustable VOSee the Table of “Output-Voltage Programming”.)  
3) LDOs Power ON/OFF Enable Control.  
4) 2.0mm×2.0mm Package.  
5) Small Ceramic Output Capacitors(1μF).  
6) Equipped with Over Current Limiter and Thermal Shutdown Circuit(TSD) .  
Applications  
Battery-powered portable equipment, etc.  
Absolute Maximum Ratings (Ta = 25)  
Parameter  
Symbol  
VIN  
Ratings  
-0.3 7  
Unit  
V
Maximum Supply Voltage (VIN)  
Maximum Input Voltage 1 (P1,P2,EN1,EN2)  
Maximum Input Voltage 2 (Vout1,Vout2)  
Power Dissipation  
VINMAX1  
VINMAX2  
Pd  
-0.3 7  
V
-0.3Vin+0.3  
1360*1  
V
mW  
Operating Temperature Range  
Topr  
-40 +85  
-55 +150  
Storage Temperature Range  
Tstg  
1
*
*
This is the allowable loss of when it is mounted on a ROHM specification board 40mm×40mm×1.5mmt  
To use at temperature higher than 25C , derate 10.9mW per 1℃  
This product is not especially designed to be protected from radioactivity.  
Recommended Operating Range (Ta=-40+85)  
Parameter  
Symbol  
VIN  
Ratings  
Unit  
V
Input Power Supply Voltage Range  
2.55.5  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.01 - Rev.C  
1/13  
Technical Note  
BD7003NUX,BD7004NUX  
Power Dissipation  
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of IC  
are shown, so please use these for reference. Since power dissipation changes substantially depending on the  
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is  
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original  
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be  
sure to prepare sufficient margin within power dissipation for usage.  
Calculation of the maximum internal power consumption of IC (PMAX)  
PMAX=(VIN-VOUT)×IOUT(MAX.)  
(VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)  
Measurement conditions  
Evaluation Board 1 (Double-side Board)  
Layout of Board for  
Measurement  
(Unit: mm)  
Top Layer (Top View)  
IC  
Implementation  
Position  
Bottom Layer (Top View)  
Power Dissipation  
1.36W  
Thermal Resistance  
θja=91.9/W  
1. 6  
Evaluation Bord1  
1. 4  
1.36W  
1. 2  
1. 0  
0. 8  
0. 6  
0. 4  
0. 2  
0. 0  
0
25  
50  
75  
100  
125  
150  
175  
200  
Ambient Temperature :Ta  
(
)
Fig.1. VSON008X2020 Power dissipation heat reduction characteristics (Reference)  
* Please design the margin so that PMAX becomes is than Pd (PMAXPd)  
within the usage temperature range.  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.01 - Rev.C  
2/13  
Technical Note  
BD7003NUX,BD7004NUX  
Electrical Characteristics (Vin=3.7V, EN1=EN2=Vin,Ta =+25, unless otherwise noted.)  
Limits  
Parameter  
Symbol  
Unit  
Condition  
Min  
1.2  
2.5  
-1.8  
-30  
300  
-
Typ  
-
Max  
3.3  
5.5  
1.8  
+30  
-
Output Voltage range  
Input Voltage range  
VOUT  
VIN  
V
V
-
Δvouta  
Δvoutb  
Imax  
Isc  
-
%
Iout=1mA, VOUT1.5V  
Output Voltage Accuracy  
-
mV  
mA  
mA  
Iout=1mA, VOUT=1.2V  
Maximum Output Current  
Short Circuit Current  
-
150  
55  
35  
120  
90  
80  
70  
360  
270  
240  
210  
0.02  
0.2  
66  
150  
-
VOUT = 0V  
-
95  
Iout=0mA  
Ground Pin Current  
Iq  
μA  
-
65  
One LDO shutdown, Iout=0mA  
VIN=2.5V, VOUT=2.6V, Iout=100mA  
VIN=2.7V, VOUT=2.8V, Iout=100mA  
VIN=2.9V, VOUT=3.0V, Iout=100mA  
VIN=3.2V, VOUT=3.3V,Iout=100mA  
VIN=2.5V, VOUT=2.6V, Iout=300mA  
VIN=2.7V, VOUT=2.8V, Iout=300mA  
VIN=2.9V, VOUT=3.0V, Iout=300mA  
VIN=3.2V, VOUT=3.3V, Iout=300mA  
VIN=VOUT+1V to VIN=5.5V, Iout=10mA  
Iout=1mA to 300mA  
-
170  
140  
130  
120  
510  
420  
390  
360  
0.2  
0.6  
-
-
-
-
-
Dropout Voltage  
Vdrop  
mV  
-
-
-
-
-
Line Regulation  
Load Regulation  
Ripple Rejection  
Output Noise  
ΔVLNR  
ΔVLDR  
PSRR  
en  
%/V  
%
dB  
f=100Hz,Iout=10mA@VOUT=1.5V  
-
μVrms fBW=10Hz to 100kHz;Iout=10mA  
EN1, EN2  
ViH  
ViL  
1.2  
-
-
0.5  
1
Regulator enabled  
Enable Input Threshold  
V
-
-
-
-
Regulator shutdown  
Enable Input Leakage Current  
Shutdown Supply Current  
Ien  
0.1  
0.1  
μA  
μA  
Ven=VIN , Ta=+25℃  
Vout=0V , Ta=+25℃  
IQSHDN  
1
*This product is not especially designed to be protected from radioactivity.  
Output-Voltage Programming  
BD7003NUX  
BD7004NUX  
PIN Name  
P1  
OPEN  
OPEN  
OPEN  
GND  
GND  
GND  
VIN  
P2  
OPEN  
GND  
VIN  
VOUT1  
1.50  
1.80  
1.80  
1.80  
1.80  
2.60  
2.80  
2.90  
2.80  
VOUT2  
VOUT1  
1.20  
1.20  
1.80  
1.80  
1.80  
1.80  
2.80  
3.00  
3.30  
VOUT2  
2.80  
2.60  
2.70  
2.80  
2.90  
2.80  
2.80  
2.90  
3.30  
1.50  
1.80  
1.50  
1.80  
3.00  
3.30  
3.00  
3.00  
3.30  
OPEN  
GND  
VIN  
Set up  
OPEN  
GND  
VIN  
VIN  
VIN  
Output Voltage Programming Input (P1P2)  
Output voltages, VOUT1 and VOUT2, are determined at power up by the state of P1 and P2 (see the table of  
“Output-Voltage Programming”). Subsequent charges to P1 and P2 do not change the output voltages unless the supply  
power is cycled, or all EN inputs are simultaneously driven low to shutdown the device.  
Shutdown (EN1, EN2)  
The BD7003NUX, BD7004NUX have independent shutdown control inputs, EN1 and EN2. Driving both EN1 and EN2  
low will shut down the entire device, reducing supply current to 1μA max. Connecting EN1 and EN2 to a logic-high or  
VIN will enable the corresponding output(s).  
It is prohibited to open EN1, EN2 switches.  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.01 - Rev.C  
3/13  
Technical Note  
BD7003NUX,BD7004NUX  
Typical Application Circuit  
BD7003NUX, BD7004NUX  
VIN  
VIN  
CIN  
1μF  
VOUT1  
COUT1  
1μF  
P1  
P2  
EN1  
VOUT2  
EN2  
VIN  
VIN  
COUT2  
1μF  
GND  
Figure2. Application Circuit  
*It is prohibited to open EN1, EN2 switches.  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.01 - Rev.C  
4/13  
Technical Note  
BD7003NUX,BD7004NUX  
Package Dimensions (VSON008X2020)  
Device name  
Lot No.  
[Unit: mm]  
Device name  
BD7003NUX  
BD7004NUX  
Marking  
BD7003  
BD7004  
Pin Descriptions  
PIN description (Top View)  
Note : Recommend connecting the Thermal Pad to the GND for excellent power dissipation.  
ESD Diode  
PIN No.  
Name  
I/O  
Function  
IN  
-
GND  
O
1
2
3
4
5
6
7
8
VIN  
EN1  
I
I
Voltage Supply  
-
O
Enable Input1  
P2  
I
O
O
-
O
Control Output-Voltage PIN2  
Control Output-Voltage PIN1  
Enable Input2  
P1  
I
O
EN2  
I
O
GND  
VOUT2  
VOUT1  
-
O
-
-
GND PIN  
O
O
O
LDO1 Output1  
-
O
LDO2 Output2  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.01 - Rev.C  
5/13  
Technical Note  
BD7003NUX,BD7004NUX  
Equivalent Circuit  
2pin, 5pin (EN)  
3pin, 4pin (P)  
3-State  
Decoder  
H
3kΩ  
3kΩ  
OPEN  
L
8pin, 7pin (VOUT)  
Block Diagram  
VIN  
1
P
EN1  
EN2  
2
5
SHUTDOWN  
AND POWER- ON  
CONTROL  
OVER CURRENT  
PROTECTION  
ERROR  
AMP  
DISCHARGE  
CIRCUIT  
P1  
P2  
4
3
OUTPUT  
VOLTAGE  
CONTROL  
8
VOUT  
1
EN1  
LDO1  
VIN  
VREF  
&
TSD  
LDO2  
GND  
6
7
VOUT  
2
Fig.3. Block Diagram  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.01 - Rev.C  
6/13  
Technical Note  
BD7003NUX,BD7004NUX  
Typical Operating Characteristics  
The test conditions for the Typical Operating Characteristics are VIN=3.7V, CIN=1.0uF, COUT=1.0uF, Ta=25, Unless otherwise noted.  
1.6  
1.4  
1.2  
1
1.4  
1.2  
1
3.5  
VOUT1=1.2V  
VOUT2=1.5V  
VOUT1=3.3V  
3
2.5  
2
Io=300mA  
Io=300mA  
Io=10mA  
Io=300mA  
Io=10mA  
0.8  
0.6  
0.4  
0.2  
0
Io=10mA  
0.8  
0.6  
0.4  
0.2  
0
1.5  
1
Io=1mA  
Io=0mA  
Io=1mA  
Io=0mA  
Io=1mA  
Io=0mA  
0.5  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
Input Voltage(V)  
Input Voltage(V)  
Input Voltage(V)  
Fig.6. Output Voltage  
(VOUT1=3.3V)  
Fig.5. Output Voltage  
(VOUT2=1.5V)  
Fig.4. Output Voltage  
(VOUT1=1.2V)  
1.6  
1.4  
1.2  
3.5  
1.4  
1.2  
1
3
VOUT1=3.3V  
Io=0mA  
Io=1mA  
VOUT1=1.2V  
Io=0mA  
1
2.5  
Io=1mA  
VOUT2=1.5V  
Io=0mA  
Io=1mA  
Io=10mA  
0.8  
2
Io=10mA  
0.8  
0.6  
0.4  
0.2  
0
Io=300mA  
Io=300mA  
Io=10mA  
0.6  
0.4  
1.5  
Io=300mA  
1
0.5  
0.2  
0
0
3.7  
4.2  
4.7  
5.2  
2.5  
3
3.5  
4
4.5  
5
5.5  
2.5  
3
3.5  
4
4.5  
5
5.5  
Input Voltage(V)  
Input Voltage(V)  
Input Voltage(V)  
Fig.9. Line Regulation  
(VOUT1=3.3V)  
Fig.7. Line Regulation  
(VOUT1=1.2V)  
Fig.8. Line Regulation  
(VOUT2=1.5V)  
10  
100  
100  
9
P1=P2=GND  
P1=P2=GND  
P1=P2=GND  
8
7
6
5
80  
60  
40  
20  
0
80  
Ta=85℃  
Ta=25℃  
Ta=-40℃  
Ta=85℃  
60  
Ta=25℃  
Ta=-40℃  
Ta=85  
Ta=25  
40  
20  
0
4
3
2
1
0
Ta=-40  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
Input Voltage (V)  
Input Voltage (V)  
Inpu Voltage (V)  
Fig.12. Circuit Current  
(VOUT1=1.8V,VOUT2=2.9V)  
EN1=GND, EN2=VIN  
Fig.11. Circuit Current  
(VOUT1=1.8V,VOUT2=2.9  
V) EN1=VIN, EN2=GND  
Fig.10. Circuit Current  
(VOUT1=1.8V,VOUT2=2.9V)  
EN1=EN2=GND  
100  
1.0  
1.0  
0.9  
0.9  
P1=P2=GND  
P1=P2=GND  
P1=P2=GND  
0.8  
0.8  
0.7  
0.6  
0.5  
0.4  
80  
60  
0.7  
0.6  
0.5  
0.4  
40  
0.3  
0.3  
Ta=85℃  
Ta=85℃  
Ta=85℃  
Ta=25  
0.2  
0.1  
0.0  
0.2  
0.1  
0.0  
Ta=25℃  
Ta=-40℃  
Ta=25℃  
20  
Ta=-40  
Ta=-40  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
Input Voltage (V)  
Input Voltage(V)  
Input Voltage (V)  
Fig.14. EN1 Input Current  
Fig.13. Circuit Current  
Fig.15. EN2 Input Current  
(VOUT1=1.8V,VOUT2=2.9V)  
EN1=EN2=VIN  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.01 - Rev.C  
7/13  
Technical Note  
BD7003NUX,BD7004NUX  
2.0  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
4
3.5  
3
1.5  
2.5  
2
Ta=85℃  
Ta=25℃  
1.0  
Ta=85℃  
Ta=25℃  
Ta=-40℃  
Ta=-40℃  
1.5  
1
0.5  
Io=0mA  
-15  
Io=0.1mA  
0.5  
0
0.0  
0
0.5  
1
1.5  
0
0.5  
1
1.5  
-40  
10  
35  
60  
85  
EN Voltage (V)  
Temp [°C]  
EN Voltage (V)  
Fig.16. EN1 Threshold  
(VOUT1=1.8V)  
Fig.17. EN2 Threshold  
(VOUT2=2.9V)  
Fig.18. VOUT - Temp  
(VOUT1=1.8V)  
4
3.5  
3
10  
100  
9
8
7
6
5
4
3
2
1
0
P1=P2=GND  
P1=P2=GND  
80  
60  
40  
20  
0
2.5  
Io=0.1mA  
Io=0mA  
2
1.5  
1
0.5  
0
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
Temp (°C)  
Temp (°C)  
Temp [°C]  
Fig.20. Icc - Temp  
(VOUT1=1.8V,VOUT2=2.9V)  
EN1=EN2=GND  
Fig.19. VOUT – Temp  
(VOUT2=3.0V)  
Fig.21.Icc- Temp  
(VOUT1=1.8V,VOUT2=2.9V)  
EN1=VIN, EN2=GND  
1.00  
100  
100  
0.90  
VIN=2.7V  
P1=P2=GND  
P1=P2=GND  
0.80  
0.70  
80  
60  
40  
20  
0
80  
60  
40  
20  
0
Temp=85℃  
0.60  
Temp=25℃  
0.50  
Temp=-40℃  
0.40  
0.30  
0.20  
0.10  
0.00  
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
0
0.05  
0.1  
0.15  
0.2  
0.25  
0.3  
Temp (°C)  
Temp (°C)  
IOUT(A)  
Fig.22. Icc - Temp  
(VOUT1=1.8V,VOUT2=2.9V)  
EN1=GND, EN2=VIN  
Fig.24. Drop Out Voltage  
(VOUT1=2.8V)  
Fig.23. Icc - Temp  
(VOUT1=1.8V,VOUT2=2.9V)  
EN1=EN2=VIN  
1.00  
4
3.5  
3
4
3.5  
3
0.90  
VIN=2.7V  
0.80  
0.70  
0.60  
2.5  
2.5  
Temp=-40°C  
Temp=25°C  
Temp=85°C  
Temp=25°C  
Temp=85°C  
Temp=-40°C  
Temp=85℃  
2
1.5  
1
2
1.5  
1
0.50  
Temp=25℃  
0.40  
Temp=-40℃  
0.30  
0.20  
0.10  
0.00  
0.5  
0
0.5  
0
0
0.05  
0.1  
0.2  
0.25  
0.3  
0
0.05  
0.10  
0.15  
0.20  
0.25  
0.30  
0.15  
0
0.05  
0.1  
0.15  
IOUT(A)  
0.2  
0.25  
0.3  
Iout2[A]  
Iout1[A]  
Fig.25. Drop Out Voltage  
(VOUT2=2.8V)  
Fig.26. Load Regulation  
(VOUT1=1.2V)  
Fig.27. Load Regulation  
(VOUT2=1.5V)  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.01 - Rev.C  
8/13  
Technical Note  
BD7003NUX,BD7004NUX  
4
3.5  
3
4
4
3.5  
3
3.5  
Temp=85°C  
Temp=-40°C  
Temp=25°C  
Temp=85°C  
Temp=25°C  
Temp=-40°  
3
2.5  
2
2.5  
2
2.5  
2
Temo=-40  
Temo=25  
Temo=85  
1.5  
1
1.5  
1
1.5  
1
0.5  
0
0.5  
0
0.5  
0
0.05  
0.1  
0.15  
0.2  
0.25  
0.3  
0
0
0.05  
0
0.1  
1
0.15  
0.2  
0  
0.25  
0
0.3  
0
50  
100  
150  
Iout1[A]  
200  
250  
300  
Iout1[A]  
Iout2[mA]  
Fig.28. Load Regulation  
(VOUT1=2.8V)  
Fig.29. Load Regulation  
(VOUT2=3.0V)  
Fig.30. Load Regulation  
(VOUT2=3.3V)  
10μsec/div  
1V/div  
10μsec/div  
1V/div  
1msec/div  
1V/div  
EN2  
EN1  
EN1  
VOUT2  
1V/div  
1V/div  
VOUT1  
VOUT1  
1V/div  
VIN=3.7  
VIN=3.7  
VIN=3.7  
Fig.32. Start Up Time  
(VOUT2=2.9V)  
IOUT=0mA  
Fig.33. Discharge Time  
(VOUT1=1.8V)  
Fig.31. Start Up Time  
(VOUT1=1.8V)  
IOUT=0mA  
IOUT=0mA  
1msec/div  
1V/div  
EN2  
ch1  
VIN  
ch1  
VIN  
4.7V  
3.7V  
1.2V  
4.7V  
3.7V  
1.5V  
1V/div  
VOUT2  
ch2  
VOUT1  
ch2  
VOUT1  
VIN=3.7  
Fig.34. Discharge Time  
(VOUT2=2.9V)  
Fig.35. VIN Response  
(VOUT1=1.2V)  
Fig.36. VIN Response  
(VOUT1=1.5V)  
IOUT=0mA  
IOUT=50mA  
IOUT=50mA  
ch1  
VIN  
ch1  
VIN  
ch1  
VIN  
4.7V  
3.7V  
3.3V  
4.7V  
3.7V  
1.8V  
4.7V  
3.7V  
3.0V  
ch2  
ch2  
VOUT1  
VOUT1  
ch2  
VOUT1  
Fig.37. VIN Response  
(VOUT1=1.8V)  
Fig.39. VIN Response  
(VOUT2=3.3V)  
Fig.38. VIN Response  
(VOUT2=3.0V)  
IOUT=50mA  
IOUT=50mA  
IOUT=50mA  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.01 - Rev.C  
9/13  
Technical Note  
BD7003NUX,BD7004NUX  
40μsec/div  
40μsec/div  
100mA/div  
40μsec/div  
100mA/div  
100mA/div  
Iout =1mA->150mA  
Iout=1mA->150mA  
Iout=150mA->1mA  
Vout1  
200mV/div  
200mV/div  
Vout1  
Vout1  
200mV/div  
1.2V  
3.3V  
1.2V  
Fig.40. Load Response  
(VOUT1=1.2V)  
Fig.41. Load Response  
(VOUT1=3.3V)  
Fig.42. Load Response  
(VOUT1=1.2V)  
IOUT=1mA150mA  
IOUT=1mA150mA  
IOUT=150mA1mA  
40μsec/div  
100mA/div  
Iout=150mA->1mA  
Vout1  
200mV/div  
3.3V  
Fig.43. Load Response  
(VOUT1=3.3V)  
IOUT=150mA1mA  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.01 - Rev.C  
10/13  
Technical Note  
BD7003NUX,BD7004NUX  
Example of EN1&EN2 used (P1=GND,P2=OPEN, VOUT1=1.8V, VOUT2=2.8V)  
Output overshoot conditions  
Whenever the LDO is turned ON, LDO1 output overshoot occurs in certain boot conditions.  
In CASE2, the overshoot value is minimum, which boot order is EN1EN2.  
The maximum over shoot occurs in CASE3, which boot order is EN2EN1.  
The overshoot value differs between input voltages(VIN), output voltage setting and EN1, EN2 input timing interval.  
CASE1: EN1 & EN2 Pins are shorted  
VIN=5.5V,EN2=EN1  
VIN=3.7V,EN2=EN1  
VOUT2(0.5V/div)  
VOUT1(0.5V/div)  
EN1(5V/div)  
EN1(5V/div)  
VOUT2(0.5V/div)  
VOUT1(0.5V/div)  
20ms/div  
20ms/div  
EN1 & EN2 Pins are independent  
VIN=5.5V,EN2=L(OFF)  
VIN=3.7V,EN2=L(OFF)  
CASE2: EN1EN2 operation(LH)  
EN1(5V/div)  
EN1(5V/div)  
VOUT1(0.5V/div)  
VOUT1(0.5V/div)  
VOUT2(0.5V/div)  
20ms/div  
VOUT2(0.5V/div)  
20ms/div  
CASE3: EN2EN1 operation(LH)  
VIN=3.7V,EN2=H(ON)  
VIN=5.5V,EN2=H(ON)  
EN1(5V/div)  
VOUT2(0.5V/div)  
VOUT1(0.5V/div)  
VOUT2(0.5V/div)  
VOUT1(0.5V/div)  
20ms/div  
20ms/div  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.01 - Rev.C  
11/13  
Technical Note  
BD7003NUX,BD7004NUX  
Notes for use  
(1) Absolute maximum ratings  
If applied voltage (VIN), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there is  
a risk of damage. Since it is not possible to identify short, open, or other damage modes, if special modes in which  
absolute maximum ratings are exceeded are assumed, consider applying fuses or other physical safety measures.  
(2) Recommended operating range  
This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics,  
it is those that are guaranteed under the conditions for each parameter. Even when these are within the recommended  
operating range, voltage and temperature characteristics are indicated.  
(3) Reverse connection of power supply connector  
There is a risk of damaging the IC by reverse connection of the power supply connector. For protection from reverse  
connection, take measures such as externally placing a diode between the power supply and the power supply pin of  
the IC.  
(4) Power supply lines  
In the design of the board pattern, make power supply and GND line wiring low impedance.  
When doing so, although the digital power supply and analog power supply are the same potential, separate the digital  
power supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due  
to the common impedance of the wiring patterns. Similarly take pattern design into account for GND lines as well.  
Furthermore, for all power supply pins of the IC, in conjunction with inserting capacitors between power supply and GND  
pins, when using electrolytic capacitors, determine constants upon adequately confirming that capacitance loss  
occurring at low temperatures is not a problem for various characteristics of the capacitors used.  
(5) GND voltage  
Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition,  
confirm that there are no pins for which the potential becomes less than a GND by actually including transition  
phenomena.  
(6) Shorts between pins and misinstallation  
When installing in the set board, pay adequate attention to orientation and placement discrepancies of the IC. If it is  
installed erroneously, there is a risk of IC damage. There also is a risk of damage if it is shorted by a foreign substance  
getting between pins , between a pin and a power supply or GND.  
(7) Operation in strong magnetic fields  
Be careful when using the IC in a strong magnetic field, since it may malfunction.  
(8) Inspection in set board  
When inspecting the IC in the set board, since there is a risk of stress to the IC when capacitors are connected to low  
impedance IC pins, be sure to discharge for each process. Moreover, when getting it on and off of a jig in the  
inspection process, always connect it after turning off the power supply, perform the inspection, and remove it after  
turning off the power supply. Furthermore, as countermeasures against static electricity, use grounding in the  
assembly process and take appropriate care in transport and storage.  
(9) Input pins  
Parasitic elements inevitably are formed on an IC structure due to potential relationships. Because parasitic elements  
operate, they give rise to interference with circuit operation and may be the cause of malfunctions as well as damage.  
Accordingly, take care not to apply a lower voltage than GND to an input pin or use the IC in other ways such that  
parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage is not  
being applied to the IC. Furthermore, when the power supply voltage is being applied, make each input pin a voltage  
less than the power supply voltage as well as within the guaranteed values of electrical characteristics.  
(10) Ground wiring pattern  
When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND  
pattern and small signal GND pattern and provide single point grounding at the reference point of the set so that voltage  
variation due to resistance components of the pattern wiring and large currents do not cause the small signal GND  
voltage to change. Take care that the GND wiring pattern of externally attached components also does not change.  
(11) Externally attached capacitors  
When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a  
lowering of the rated capacitance due to DC bias and capacitance change due to factors such as temperature.  
(12) Thermal shutdown circuit (TSD)  
When the junction temperature becomes 180(typ) or higher, the thermal shutdown circuit operates and turns the  
switch OFF. The thermal shutdown circuit, which is aimed at isolating the IC from thermal runaway as much as possible,  
is not aimed at the protection or guarantee of the IC. Therefore, do not continuously use the IC with this circuit  
operating or use the IC assuming its operation.  
(13) Thermal design  
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in  
actual states of use.  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.01 - Rev.C  
12/13  
Technical Note  
BD7003NUX,BD7004NUX  
Ordering part number  
B D  
7
0
0
3
N U X  
-
E
2
Part No.  
Part No.  
7003  
7004  
Package  
NUX: VSON008X2020  
Packaging and forming specification  
E2: Embossed tape and reel  
VSON008X2020  
<Tape and Reel information>  
2.0 0.05  
Tape  
Embossed carrier tape  
4000pcs  
Quantity  
E2  
Direction  
of feed  
1PIN MARK  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
S
(
)
1.5 0.1  
0.5 0.1  
0.05  
S
C0.25  
1
4
5
8
+0.05  
0.250.04  
Direction of feed  
1pin  
1.5 0.1  
Reel  
(Unit : mm)  
Order quantity needs to be multiple of the minimum quantity.  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.01 - Rev.C  
13/13  
Notice  
N o t e s  
No copying or reproduction of this document, in part or in whole, is permitted without the  
consent of ROHM Co.,Ltd.  
The content specified herein is subject to change for improvement without notice.  
The content specified herein is for the purpose of introducing ROHM's products (hereinafter  
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,  
which can be obtained from ROHM upon request.  
Examples of application circuits, circuit constants and any other information contained herein  
illustrate the standard usage and operations of the Products. The peripheral conditions must  
be taken into account when designing circuits for mass production.  
Great care was taken in ensuring the accuracy of the information specified in this document.  
However, should you incur any damage arising from any inaccuracy or misprint of such  
information, ROHM shall bear no responsibility for such damage.  
The technical information specified herein is intended only to show the typical functions of and  
examples of application circuits for the Products. ROHM does not grant you, explicitly or  
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and  
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the  
use of such technical information.  
The Products specified in this document are intended to be used with general-use electronic  
equipment or devices (such as audio visual equipment, office-automation equipment, commu-  
nication devices, electronic appliances and amusement devices).  
The Products specified in this document are not designed to be radiation tolerant.  
While ROHM always makes efforts to enhance the quality and reliability of its Products, a  
Product may fail or malfunction for a variety of reasons.  
Please be sure to implement in your equipment using the Products safety measures to guard  
against the possibility of physical injury, fire or any other damage caused in the event of the  
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM  
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed  
scope or not in accordance with the instruction manual.  
The Products are not designed or manufactured to be used with any equipment, device or  
system which requires an extremely high level of reliability the failure or malfunction of which  
may result in a direct threat to human life or create a risk of human injury (such as a medical  
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-  
controller or other safety device). ROHM shall bear no responsibility in any way for use of any  
of the Products for the above special purposes. If a Product is intended to be used for any  
such special purpose, please contact a ROHM sales representative before purchasing.  
If you intend to export or ship overseas any Product or technology specified herein that may  
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to  
obtain a license or permit under the Law.  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact us.  
ROHM Customer Support System  
http://www.rohm.com/contact/  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
R1120  
A
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