IN74LV04
MAXIMUM RATINGS*
Symbol
Parameter
Value
-0.5 ÷ +7.0
±20
Unit
V
mA
mA
mA
VCC
IIK*1
IOK*2
Io*3
DC supply voltage (Referenced to GND)
DC input diode current
DC output diode current
±50
DC
output
source
or
for
for
sink
types
types
current
with
±25
-bus driver outputs
DC GND current
- bus driver outputs
DC VCC current
IGND
ICC
mA
mA
mW
±50
±50
with
- bus driver outputs
PD
Power dissipation per package, plastic DIP+
750
500
SOIC
package+
Tstg
TL
Storage temperature
-65 ÷ +150
°C
°C
Lead temperature, 1.5 mm from Case for 10
seconds
260
(Plastic DIP ), 0.3 mm (SOIC Package)
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 12 mW/°C from 70° to 125°C
SOIC Package: : - 8 mW/°C from 70° to 125°C
*1: VI < -0.5V or VI > VCC+0.5V
*2: Vo < -0.5V or Vo > VCC+0.5V
*3: -0.5V < Vo < VCC+0.5V
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Min
1.0
0
Max
5.5
Unit
V
DC Supply Voltage (Referenced to GND)
VIN, VOUT DC Input Voltage, Output Voltage (Referenced to
GND)
VCC
V
TA
tr, tf
Operating Temperature, All Package Types
Input Rise and Fall Time
-40
+125
°C
ns
VCC
VCC
VCC
=1.2
=2.0
=3.0
V
V
V
0
0
0
0
1000
700
500
400
V
CC =3.6 V
This device contains protection circuitry to guard against damage due to high static
voltages or electric fields. However, precautions must be taken to avoid applications of any voltage
higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and
V
OUT should be constrained to the range GND≤(VIN or VOUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or
VCC). Unused outputs must be left open.
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