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TDA2822

型号：

TDA2822

描述：

双功放[ DUAL POWER AMPLIFIER ]

品牌：

STMICROELECTRONICS[ ST ]

页数：

11 页

PDF大小：

165 K

下载PDF手册
TDA2822  
DUAL POWER AMPLIFIER  
.
.
.
.
SUPPLY VOLTAGE DOWN TO 3 V  
LOW CROSSOVER DISTORSION  
LOW QUIESCENT CURRENT  
BRIDGE OR STEREO CONFIGURATION  
POWERDIP  
(Plastic 12+2+2)  
ORDERING NUMBER : TDA2822  
DESCRIPTION  
The TDA2822 is a monolithic integrated circuit in  
12+2+2 powerdip, intended for use as dual audio  
power amplifier in portable radios and TS sets.  
TYPICAL APPLICATION CIRCUIT (STEREO)  
March 1995  
1/11  
TDA2822  
PIN CONNECTION (top view)  
SCHEMATIC DIAGRAM  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
15  
Unit  
V
Vs  
Io  
Supply Voltage  
Output Peak Current  
1.5  
A
Ptot  
Total Power Dissipation at Tamb = 50 °C  
at Tcase = 70 °C  
1.25  
4
W
W
Tstg, Tj Storage and Junction Temperature  
– 40 to 150  
°C  
2/11  
TDA2822  
THERMAL DATA  
Symbol  
Parameter  
Value  
Unit  
Rth j-amb Thermal Resistance Junction-ambient  
Rth j-case Thermal Resistance Junction-pins  
Max  
Max  
80  
20  
°C/W  
°C/W  
ELECTRICAL CHARACTERISTICS (Vs = 6 V, Tamb = 25 °C, unless otherwise specified)  
STEREO (test circuit of fig. 1)  
Symbol  
Vs  
Parameter  
Supply Voltage  
Test Condition  
Min.  
Typ.  
Max.  
Unit  
3
15  
V
Vc  
Quiescent Output Voltage  
Vs = 9 V  
Vs = 6 V  
4
2.7  
V
V
Id  
Ib  
Quiescent Drain Current  
Input Bias Current  
6
12  
mA  
nA  
100  
Po  
Output Power  
(each channel)  
d = 10 % f = 1 kHz  
Vs = 9 V RL = 4 Ω  
Vs = 6 V RL = 4 Ω  
Vs = 4.5 V RL = 4 Ω  
1.3  
0.45  
1.7  
0.65  
0.32  
W
W
W
Gv  
Ri  
eN  
Closed Loop Voltage Gain  
Input Resistance  
f = 1 kHz  
f = 1 kHz  
36  
39  
41  
dB  
100  
kΩ  
Total Input Noise  
Rs = 10 kΩ  
B = 22 Hz to 22 kHz  
Curve A  
2.5  
2
µV  
µV  
SVR  
CS  
Supply Voltage Rejection  
Channel Separation  
f = 100 Hz  
24  
3
30  
50  
dB  
dB  
Rg = 10 kΩ f = 1 kHz  
BRIDGE (test circuit of fig. 2)  
Vs  
Id  
Supply Voltage  
15  
12  
60  
V
Quiescent Drain Current  
Output Offset Voltage  
Input Bias Current  
Output Power  
RL = ∞  
6
mA  
mV  
nA  
Vos  
Ib  
RL = 8 Ω  
10  
100  
Po  
d = 10 % f = 1 kHz  
Vs = 9 V RL = 8 Ω  
Vs = 6 V RL = 8 Ω  
Vs = 4.5 V RL = 4 Ω  
2.7  
0.9  
3.2  
1.35  
1
W
W
W
d
Distortion (f = 1 kHz)  
Closed Loop Voltage Gain  
Input Resistance  
RL = 8 Ω Po = 0.5 W  
f = 1 kHz  
0.2  
39  
%
dB  
kΩ  
Gv  
Ri  
f = 1 kHz  
100  
eN  
Total Input Noise  
Rs = 10 kΩ  
B = 22 Hz to 22 kHz  
Curve A  
3
2.5  
µV  
µV  
SVR  
Supply Voltage Rejection  
f = 100 Hz  
40  
dB  
3/11  
TDA2822  
Figure 1 : Test Circuit (stereo).  
Figure 2 : P.C. Board and Components Layout of the Circuit of Figure 1 (1:1 scale).  
4/11  
TDA2822  
Figure 3 : Test Circuit (bridge).  
Figure 4 : P.C. Board and Components Layout of the Circuit of Figure 3 (1:1 scale).  
5/11  
TDA2822  
Figure 5 : OutputPower vs. Supply Voltage  
Figure 6 : Output Power vs. Supply Voltage  
(Stereo).  
(Bridge).  
Figure 7 : Distorsion vs. Output Power (Bridge).  
Figure 8 : Distorsion vs. Output Power (Bridge).  
Figure 9 : Supply Voltage Rejection vs.  
Figure 10 : QuiescentCurrent vs. Supply Voltage.  
Frequency.  
6/11  
TDA2822  
Figure 11 : Total Power Dissipation vs. Output  
Figure 12 : Total Power Dissipation vs. Output  
Power (Bridge).  
Power (Stereo).  
Figure 13 : Total Power Dissipation vs. Output  
Power (Bridge).  
7/11  
TDA2822  
Figure 14 : Application Circuit for PortableRadios.  
MOUNTING INSTRUCTION  
TheRth j-amb of theTDA2822 can be reducedbysol-  
deringthe GND pins toa suitablecopperarea of the  
printed circuit board (Figure 15) or to an external  
heatsink(Figure 16).  
During soldering the pins temperature must not ex-  
ceed 260 °C and the soldering time must not be  
longer than 12 seconds.  
The externalheatsink or printed circuit copper area  
must be connected to electrical ground.  
The diagram of Figure 17 shows the maximum dis-  
sipable power Ptot and the Rth j-amb as a functionof  
theside ”∂” oftwoequalsquarecopperareashaving  
a thickness of 35 µ (1.4 mils).  
Figure 15 : Example of P.C. Board Copper Area  
Figure 16 : ExternalHeatsink Mounting Example.  
which is used as Heatsink.  
8/11  
TDA2822  
Figure 6 : Maximum Dissipable Power and  
Junction to Ambient Thermal  
Figure 7 : Maximum Allowable Power Dissipation  
vs. Ambient Temperature.  
Resistance vs. Side ”∂”.  
9/11  
TDA2822  
POWERDIP 16 PACKAGE MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
0.51  
0.85  
TYP.  
MAX.  
MIN.  
0.020  
0.033  
MAX.  
a1  
B
b
1.40  
0.055  
0.50  
0.020  
b1  
D
E
e
0.38  
0.50  
20.0  
0.015  
0.020  
0.787  
8.80  
2.54  
0.346  
0.100  
0.700  
e3  
F
17.78  
7.10  
5.10  
0.280  
0.201  
I
L
3.30  
0.130  
Z
1.27  
0.050  
10/11  
TDA2822  
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for  
the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its  
use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifica-  
tions mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information pre-  
viously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or  
systems without express written approval of SGS-THOMSON Microelectronics.  
1995 SGS-THOMSON Microelectronics - All Rights Reserved  
SGS-THOMSON Microelectronics GROUP OF COMPANIES  
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore-  
Spain - Sweden - Switzerland - Taiwan - Thaliand - United Kingdom - U.S.A.  
11/11  
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