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NVMD4N03R2G

型号:

NVMD4N03R2G

描述:

功率MOSFET 4 A, 30 V ,NA ????通道SOA ???? 8双[ Power MOSFET 4 A, 30 V, N−Channel SO−8 Dual ]

品牌:

ONSEMI[ ONSEMI ]

页数:

8 页

PDF大小:

126 K

NTMD4N03, NVMD4N03  
Power MOSFET  
4 A, 30 V, NChannel SO8 Dual  
Features  
Designed for use in low voltage, high speed switching applications  
Ultra Low OnResistance Provides  
http://onsemi.com  
Higher Efficiency and Extends Battery Life  
R  
R  
= 0.048 W, V = 10 V (Typ)  
DS(on)  
DS(on)  
GS  
= 0.065 W, V = 4.5 V (Typ)  
GS  
V
R
Typ  
I Max  
D
DSS  
DS(ON)  
Miniature SO8 Surface Mount Package Saves Board Space  
Diode is Characterized for Use in Bridge Circuits  
Diode Exhibits High Speed, with Soft Recovery  
30 V  
48 mW @ V = 10 V  
4.0 A  
GS  
NVMD Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AECQ101  
Qualified and PPAP Capable*  
NChannel  
D
D
These Devices are PbFree and are RoHS Compliant  
Applications  
G
8
G
DCDC Converters  
Computers  
Printers  
Cellular and Cordless Phones  
Disk Drives and Tape Drives  
S
S
MARKING DIAGRAM*  
AND PIN ASSIGNMENT  
D1 D1 D2 D2  
8
1
SOIC8  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
SUFFIX NB  
CASE 751  
STYLE 11  
E4N03  
AYWW G  
G
Rating  
Symbol  
Value  
Unit  
DraintoSource Voltage  
GatetoSource Voltage Continuous  
Drain Current  
V
DSS  
30  
V
V
V
GS  
"20  
1
S1 G1 S2 G2  
Continuous @ T = 25°C  
Single Pulse (tp 10 ms)  
I
4.0  
12  
Adc  
Apk  
A
D
I
DM  
E4N03 = Specific Device Code  
Total Power Dissipation  
P
D
2.0  
W
°C  
mJ  
A
Y
WW  
G
= Assembly Location  
= Year  
= Work Week  
@ T = 25°C (Note 1)  
A
Operating and Storage  
Temperature Range  
T , T  
55 to  
+150  
J
stg  
= PbFree Package  
(Note: Microdot may be in either location)  
Single Pulse DraintoSource  
E
AS  
80  
*For additional marking information, refer to  
Application Note AND8002/D.  
Avalanche Energy Starting T = 25°C  
J
(V = 25 Vdc, V = 5.0 Vdc,  
DD  
GS  
Peak I = 4.45 Apk, L = 8 mH,  
L
R
G
= 25 W)  
ORDERING INFORMATION  
Thermal Resistance  
R
q
JA  
62.5  
260  
°C/W  
°C  
JunctiontoAmbient (Note 1)  
Device  
Package  
SOIC8  
(PbFree)  
Shipping  
2500 / Tape &  
Reel  
NTMD4N03R2G  
Maximum Lead Temperature for  
T
L
Soldering Purposes for 10 seconds  
NVMD4N03R2G*  
SOIC8  
(PbFree)  
2500 / Tape &  
Reel  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D  
1. When surface mounted to an FR4 board using 1pad size, t 10 s  
©
Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
August, 2013 Rev. 4  
NTMD4N03R2/D  
 
NTMD4N03, NVMD4N03  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
(V = 0 Vdc, I = 250 mA)  
V
Vdc  
mV/°C  
mAdc  
(BR)DSS  
30  
GS  
D
32  
Temperature Coefficient (Positive)  
Zero Gate Voltage Drain Current  
I
DSS  
(V = 30 Vdc, V = 0 Vdc, T = 25°C)  
1.0  
10  
DS  
GS  
J
(V = 30 Vdc, V = 0 Vdc, T = 125°C)  
DS  
GS  
J
GateBody Leakage Current  
(V 20 Vdc, V = 0 Vdc)  
I
nAdc  
GSS  
=
100  
GS  
DS  
ON CHARACTERISTICS (Note 2)  
Gate Threshold Voltage  
V
Vdc  
mV/°C  
W
GS(th)  
(V = V , I = 250 mAdc)  
1.0  
1.9  
4.2  
3.0  
DS  
GS  
D
Temperature Coefficient (Negative)  
Static DraintoSource OnState Resistance  
R
DS(on)  
(V = 10 Vdc, I = 4 Adc)  
0.048  
0.065  
0.060  
0.080  
GS  
D
(V = 4.5 Vdc, I = 2 Adc)  
GS  
D
Forward Transconductance  
(V = 3 Vdc, I = 2 Adc)  
g
Mhos  
pF  
FS  
6.0  
DS  
D
DYNAMIC CHARACTERISTICS  
Input Capacitance  
C
285  
95  
400  
135  
70  
iss  
(V = 20 Vdc, V = 0 Vdc,  
DS  
GS  
Output Capacitance  
C
oss  
f = 1.0 MHz)  
Reverse Transfer Capacitance  
C
35  
rss  
SWITCHING CHARACTERISTICS (Notes 2 & 3)  
TurnOn Delay Time  
t
7.0  
14  
15  
30  
30  
20  
16  
ns  
d(on)  
(V = 20 Vdc, I = 2 A,  
DD  
D
Rise Time  
t
r
V
R
= 10 V,  
= 2 W)  
GS  
TurnOff Delay Time  
Fall Time  
t
16  
d(off)  
G
t
f
10  
Gate Charge  
Q
T
Q
1
Q
2
8.0  
1.1  
1.9  
nC  
(V = 10 Vdc,  
DS  
V
GS  
= 10 Vdc,  
= 3.5 A)  
I
D
BODYDRAIN DIODE RATINGS (Note 2)  
Diode Forward OnVoltage  
(I = 2 Adc, V = 0 V)  
V
SD  
0.82  
0.63  
1.0  
Vdc  
ns  
S
GS  
(I = 2 Adc, V = 0 V, T = 150°C)  
S
GS  
J
Reverse Recovery Time  
t
rr  
14  
10  
(I = 2 A, V = 0 V,  
S
GS  
t
a
dI /dt = 100 A/ms)  
S
t
b
4.0  
Reverse Recovery Stored Charge  
Q
0.008  
mC  
RR  
(I = 2 A, dI /dt = 100 A/ms, V = 0 V)  
S
S
GS  
2. Pulse Test: Pulse Width 300 ms, Duty Cycle 2%.  
3. Switching characteristics are independent of operating junction temperature.  
http://onsemi.com  
2
 
NTMD4N03, NVMD4N03  
TYPICAL MOSFET ELECTRICAL CHARACTERISTICS  
7
8
6
4
3.6 V  
4 V  
10 V  
V
DS  
10 V  
6
5
4
3
2
8 V  
6 V  
5 V  
4.5 V  
T = 25°C  
J
V
GS  
= 3 V  
2
0
1
0
T = 125°C  
J
T = 55°C  
J
T = 25°C  
J
0
0.2  
0.4  
0.6  
0.8  
1.0  
0
1
2
3
4
5
V , DRAINTOSOURCE VOLTAGE (VOLTS)  
DS  
V , GATETOSOURCE VOLTAGE (VOLTS)  
GS  
Figure 1. OnRegion Characteristics  
Figure 2. Transfer Characteristics  
0.10  
0.075  
0.05  
0.10  
0.08  
0.06  
0.04  
V
GS  
= 10  
T = 25°C  
J
T = 125°C  
V
= 4.5 V  
= 10 V  
GS  
V
T = 25°C  
GS  
T = 55°C  
0.025  
0
0.02  
0
2
3
4
5
6
7
8
2
3
4
5
6
7
8
I , DRAIN CURRENT (AMPS)  
D
I , DRAIN CURRENT (AMPS)  
D
Figure 3. OnResistance versus Drain Current  
Figure 4. OnResistance versus Drain Current  
and Temperature  
and Gate Voltage  
10,000  
1000  
1.5  
1.375  
1.25  
1.125  
1
V
GS  
= 0 V  
I
V
= 2 A  
D
= 10 V  
GS  
T = 150°C  
J
100  
10  
T = 125°C  
J
0.875  
0.75  
50 25  
0
25  
50  
75  
100  
125 150  
0
5
10  
15  
20  
25  
30  
T , JUNCTION TEMPERATURE (°C)  
J
V , DRAINTOSOURCE VOLTAGE (VOLTS)  
DS  
Figure 5. OnResistance Variation with  
Figure 6. DraintoSource Leakage Current  
Temperature  
versus Voltage  
http://onsemi.com  
3
NTMD4N03, NVMD4N03  
POWER MOSFET SWITCHING  
Switching behavior is most easily modeled and predicted  
by recognizing that the power MOSFET is charge  
controlled. The lengths of various switching intervals (Dt)  
are determined by how fast the FET input capacitance can  
be charged by current from the generator.  
The capacitance (C ) is read from the capacitance curve at  
a voltage corresponding to the offstate condition when  
iss  
calculating t  
and is read at a voltage corresponding to the  
d(on)  
onstate when calculating t  
.
d(off)  
At high switching speeds, parasitic circuit elements  
complicate the analysis. The inductance of the MOSFET  
source lead, inside the package and in the circuit wiring  
which is common to both the drain and gate current paths,  
produces a voltage at the source which reduces the gate drive  
current. The voltage is determined by Ldi/dt, but since di/dt  
is a function of drain current, the mathematical solution is  
complex. The MOSFET output capacitance also  
complicates the mathematics. And finally, MOSFETs have  
finite internal gate resistance which effectively adds to the  
resistance of the driving source, but the internal resistance  
is difficult to measure and, consequently, is not specified.  
The resistive switching time variation versus gate  
resistance (Figure 9) shows how typical switching  
performance is affected by the parasitic circuit elements. If  
the parasitics were not present, the slope of the curves would  
maintain a value of unity regardless of the switching speed.  
The circuit used to obtain the data is constructed to minimize  
common inductance in the drain and gate circuit loops and  
is believed readily achievable with board mounted  
components. Most power electronic loads are inductive; the  
data in the figure is taken with a resistive load, which  
approximates an optimally snubbed inductive load. Power  
MOSFETs may be safely operated into an inductive load;  
however, snubbing reduces switching losses.  
The published capacitance data is difficult to use for  
calculating rise and fall because draingate capacitance  
varies greatly with applied voltage. Accordingly, gate  
charge data is used. In most cases, a satisfactory estimate of  
average input current (I ) can be made from a  
G(AV)  
rudimentary analysis of the drive circuit so that  
t = Q/I  
G(AV)  
During the rise and fall time interval when switching a  
resistive load, V remains virtually constant at a level  
GS  
known as the plateau voltage, V . Therefore, rise and fall  
SGP  
times may be approximated by the following:  
t = Q x R /(V V )  
GSP  
r
2
G
GG  
t = Q x R /V  
f
2
G
GSP  
where  
= the gate drive voltage, which varies from zero to V  
V
GG  
GG  
R = the gate drive resistance  
G
and Q and V  
are read from the gate charge curve.  
2
GSP  
During the turnon and turnoff delay times, gate current is  
not constant. The simplest calculation uses appropriate  
values from the capacitance curves in a standard equation for  
voltage change in an RC network. The equations are:  
t
t
= R C In [V /(V V )]  
G iss GG GG GSP  
d(on)  
d(off)  
= R C In (V /V )  
GG GSP  
G
iss  
800  
T = 25°C  
J
C
C
iss  
600  
400  
rss  
C
iss  
200  
0
C
C
oss  
rss  
V
= 0 V  
V
= 0 V  
5
DS  
GS  
10  
5
GS  
0
10  
15  
20  
25  
V
V
DS  
GATETOSOURCE OR DRAINTOSOURCE  
VOLTAGE (VOLTS)  
Figure 7. Capacitance Variation  
http://onsemi.com  
4
NTMD4N03, NVMD4N03  
30  
10  
100  
t
Q
d(off)  
T
V
I
= 15 V  
= 4 A  
= 10 V  
DD  
t
D
V
f
GS  
V
GS  
8
6
4
2
0
t
r
20  
10  
0
V
DS  
10  
Q
Q
2
1
2
t
d(on)  
I
D
= 4 A  
T = 25°C  
J
1
0
1
3
4
5
6
7
8
9
10  
1
10  
100  
Q , TOTAL GATE CHARGE (nC)  
g
R , GATE RESISTANCE (W)  
G
Figure 8. GatetoSource and  
DraintoSource Voltage versus Total Charge  
Figure 9. Resistive Switching Time Variation  
versus Gate Resistance  
DRAINTOSOURCE DIODE CHARACTERISTICS  
The switching characteristics of a MOSFET body diode  
are very important in systems using it as a freewheeling or  
commutating diode. Of particular interest are the reverse  
recovery characteristics which play a major role in  
determining switching losses, radiated noise, EMI and RFI.  
System switching losses are largely due to the nature of  
the body diode itself. The body diode is a minority carrier  
high di/dts. The diode’s negative di/dt during t is directly  
controlled by the device clearing the stored charge.  
a
However, the positive di/dt during t is an uncontrollable  
b
diode characteristic and is usually the culprit that induces  
current ringing. Therefore, when comparing diodes, the  
ratio of t /t serves as a good indicator of recovery  
b a  
abruptness and thus gives a comparative estimate of  
probable noise generated. A ratio of 1 is considered ideal and  
values less than 0.5 are considered snappy.  
device, therefore it has a finite reverse recovery time, t , due  
rr  
to the storage of minority carrier charge, Q , as shown in  
RR  
the typical reverse recovery wave form of Figure 14. It is this  
stored charge that, when cleared from the diode, passes  
through a potential and defines an energy loss. Obviously,  
repeatedly forcing the diode through reverse recovery  
further increases switching losses. Therefore, one would  
Compared to ON Semiconductor standard cell density  
low voltage MOSFETs, high cell density MOSFET diodes  
are faster (shorter t ), have less stored charge and a softer  
rr  
reverse recovery characteristic. The softness advantage of  
the high cell density diode means they can be forced through  
reverse recovery at a higher di/dt than a standard cell  
MOSFET diode without increasing the current ringing or the  
noise generated. In addition, power dissipation incurred  
from switching the diode will be less due to the shorter  
recovery time and lower switching losses.  
like a diode with short t and low Q specifications to  
rr  
RR  
minimize these losses.  
The abruptness of diode reverse recovery effects the  
amount of radiated noise, voltage spikes, and current  
ringing. The mechanisms at work are finite irremovable  
circuit parasitic inductances and capacitances acted upon by  
4
V
GS  
= 0 V  
T = 25°C  
J
3
2
1
0
0.5  
0.6  
0.7  
0.8  
0.9  
V , SOURCETODRAIN VOLTAGE (VOLTS)  
SD  
Figure 10. Diode Forward Voltage versus Current  
http://onsemi.com  
5
NTMD4N03, NVMD4N03  
SAFE OPERATING AREA  
The Forward Biased Safe Operating Area curves define  
total power averaged over a complete switching cycle must  
not exceed (T T )/(R ).  
the maximum simultaneous draintosource voltage and  
drain current that a transistor can handle safely when it is  
forward biased. Curves are based upon maximum peak  
J(MAX)  
C
qJC  
A power MOSFET designated EFET can be safely used  
in switching circuits with unclamped inductive loads. For  
reliable operation, the stored energy from circuit inductance  
dissipated in the transistor while in avalanche must be less  
than the rated limit and must be adjusted for operating  
conditions differing from those specified. Although industry  
practice is to rate in terms of energy, avalanche energy  
capability is not a constant. The energy rating decreases  
nonlinearly with an increase of peak current in avalanche  
and peak junction temperature.  
junction temperature and a case temperature (T ) of 25°C.  
C
Peak repetitive pulsed power limits are determined by using  
the thermal response data in conjunction with the procedures  
discussed in AN569, “Transient Thermal Resistance −  
General Data and Its Use.”  
Switching between the offstate and the onstate may  
traverse any load line provided neither rated peak current  
(I ) nor rated voltage (V ) is exceeded, and that the  
DM  
DSS  
transition time (t , t ) does not exceed 10 ms. In addition the  
r
f
80  
100  
10  
1
V
= 20 V  
GS  
I
D
= 4.45 A  
SINGLE PULSE  
T
= 25°C  
C
60  
40  
1.0 ms  
10 ms  
20  
0
0.1  
dc  
R
LIMIT  
DS(on)  
THERMAL LIMIT  
PACKAGE LIMIT  
0.01  
0.1  
1.0  
10  
25  
50  
75  
100  
125  
150  
100  
V , DRAINTOSOURCE VOLTAGE (VOLTS)  
DS  
T , STARTING JUNCTION TEMPERATURE (°C)  
J
Figure 11. Maximum Rated Forward Biased  
Safe Operating Area  
Figure 12. Maximum Avalanche Energy versus  
Starting Junction Temperature  
http://onsemi.com  
6
NTMD4N03, NVMD4N03  
TYPICAL ELECTRICAL CHARACTERISTICS  
1.0  
0.1  
D = 0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.0106 W 0.0431 W 0.1643 W 0.3507 W 0.4302 W  
CHIP  
JUNCTION  
0.01  
0.0253 F 0.1406 F 0.5064 F 2.9468 F 177.14 F  
AMBIENT  
SINGLE PULSE  
1.0E-04  
0.001  
1.0E-05  
1.0E-03  
1.0E-02  
1.0E-01  
1.0E+00  
1.0E+01  
1.0E+02  
1.0E+03  
t, TIME (s)  
Figure 13. Thermal Response  
di/dt  
I
S
t
rr  
t
a
t
b
TIME  
0.25 I  
t
p
S
I
S
Figure 14. Diode Reverse Recovery Waveform  
http://onsemi.com  
7
NTMD4N03, NVMD4N03  
PACKAGE DIMENSIONS  
SOIC8 NB  
CASE 75107  
ISSUE AK  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
X−  
A
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
6. 75101 THRU 75106 ARE OBSOLETE. NEW  
STANDARD IS 75107.  
S
M
M
B
0.25 (0.010)  
Y
1
K
Y−  
MILLIMETERS  
DIM MIN MAX  
INCHES  
G
MIN  
MAX  
0.197  
0.157  
0.069  
0.020  
A
B
C
D
G
H
J
K
M
N
S
4.80  
3.80  
1.35  
0.33  
5.00 0.189  
4.00 0.150  
1.75 0.053  
0.51 0.013  
C
N X 45  
_
SEATING  
PLANE  
1.27 BSC  
0.050 BSC  
Z−  
0.10  
0.19  
0.40  
0
0.25 0.004  
0.25 0.007  
1.27 0.016  
0.010  
0.010  
0.050  
8
0.020  
0.244  
0.10 (0.004)  
M
J
H
D
8
0
_
_
_
_
0.25  
5.80  
0.50 0.010  
6.20 0.228  
M
S
S
X
0.25 (0.010)  
Z
Y
SOLDERING FOOTPRINT*  
STYLE 11:  
PIN 1. SOURCE 1  
2. GATE 1  
3. SOURCE 2  
4. GATE 2  
5. DRAIN 2  
6. DRAIN 2  
7. DRAIN 1  
8. DRAIN 1  
1.52  
0.060  
7.0  
4.0  
0.275  
0.155  
0.6  
0.024  
1.270  
0.050  
mm  
inches  
ǒ
Ǔ
SCALE 6:1  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,  
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC  
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any  
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without  
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications  
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC  
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for  
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where  
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and  
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,  
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture  
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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For additional information, please contact your local  
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NTMD4N03R2/D  
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