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XTC7004

型号:

XTC7004

品牌:

MURATA[ muRata ]

页数:

4 页

PDF大小:

476 K

XTC7004  
• Temperature Compensated Crystal Oscillator  
• Miniature SMD Package  
• Excellent Frequency Stability  
• Low Phase Noise  
16.367667 MHz  
TCXO  
• Complies with Directive 2002/95/EC (RoHS)  
P
b
4-Terminal SMD Case  
Electrical Characteristics  
Characteristic  
Sym  
Notes  
Minimum  
Typical  
Maximum  
Units  
F
Nominal Frequency  
16.367667  
MHz  
O
Frequency Tolerance after Reflow  
Storage Temperature Range in Tape and Reel  
Operating Temperature Range  
±2 ppm maximum @ 25 ±3 °C  
-40  
+85  
+85  
3.00  
°C  
°C  
V
-30  
2.70  
0.8  
V
Power Supply Voltage  
2.85  
DD  
V
Output Voltage with 10 pF || 10 KLoad  
Output Waveform  
P-P  
Clipped Sinewave  
I
Power Supply Current  
2.0  
mA  
DD  
Frequency Stability versus:  
Temperature, -30 to 85 °C  
±0.5  
±0.2  
±0.2  
±0.05  
0.8  
ppm  
ppm  
ppm  
ppm  
ppb  
Load Variation, 10 pF || 10 K±10%  
Supply Voltage, 2.85 V ±5%  
Frequency Slope, one measurement every 2 °C  
Short Term Stability (STS)  
Static Temperature Hysteresis  
±0.6  
2.0  
ppm  
ms  
Start Up Time, 90% of Final RF level in V  
P-P  
Harmonics  
-7.0  
-130  
±1.0  
dBc  
SSB Phase Noise @ 1 kHz Carrier Offset  
Aging @ 25 °C  
dBc/Hz  
ppm  
units  
Stanard Shipping Quantity on 180 mm (7”) Reel  
Lid Symbolization (in addition to Lot and/or Date Codes)  
1000  
Line1: 7004 Line2: YWWS  
Pin Connections  
Connection  
Ground  
Terminals  
1
2
3
4
Ground  
TCXO Output  
V
DD  
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.  
Notes:  
1. The design, manufacturing process, and specifications of this device are subject to change without notice.  
www.RFM.com E-mail: info@rfm.com  
©2009-2011 by RF Monolithics, Inc.  
Page 1 of 4  
XTC7004 - 4/4/11  
4-Terminal Surface-Mount Seam Weld Case  
3.2 x 2.5 mm Nominal Footprint  
D
A
C
E
4
3
3
4
B
F
G
2
1
I
1
2
Top  
Side  
Bottom  
H
Case and PCB Land Dimensions  
mm  
Inches  
Nom  
0.126  
0.098  
-
4
3
Dimension  
Min  
Nom  
3.20  
2.50  
-
Max  
Min  
Max  
A
B
C
D
E
F
G
H
I
3.00  
3.40  
0.118  
0.134  
2.30  
2.70  
0.091  
0.106  
L
M
-
-
-
-
-
-
-
-
-
-
-
1.20  
-
-
-
-
-
-
-
-
-
-
-
0.047  
3.08  
1.80  
2.38  
1.00  
0.60  
0.65  
3.60  
1.60  
2.90  
0.80  
-
-
-
-
-
-
-
-
-
-
0.121  
0.071  
0.094  
0.039  
0.024  
0.026  
0.142  
0.063  
0.114  
0.031  
-
-
-
-
-
-
-
-
-
-
1
2
J
K
K
L
M
J
PCB Land Pattern  
(Top View)  
Case Materials  
Materials  
Solder Pad  
Plating  
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel  
V
D
D
Lid Plating  
Body  
2.0 to 3.0 µm Nickel  
Al O Ceramic  
2
3
Pb Free  
4
3
1
2
T
e m p e r a t u r e  
o m p e n s a t e d  
1
0
n
F
C
C
r y s t a l  
s c i l l a t o r  
O
O
u
t
p
u
t
TCXO Application Circuit  
www.RFM.com E-mail: info@rfm.com  
©2009-2011 by RF Monolithics, Inc.  
Page 2 of 4  
XTC7004 - 4/4/11  
Typical Solder Reflow Profile  
R
a
m
p
u
p
P
r
e
h
e
a
t
R
e
f
l
o
w
C
o
o
l
D
o
w
n
3
2
2
1
1
0
5
0
5
0
0
0
0
0
0
5
0
O
M
a
x
i
m
u
m
p
e
a
k
t
e
m
p
e
r
a
t
u
r
e
:
2
6
0
C
0
0
6
0
1
2
0
1
8
0
2
4
0
3
0
0
3
6
0
T
i
m
e
(
s
e
c
o
n
d
s
)
www.RFM.com E-mail: info@rfm.com  
©2009-2011 by RF Monolithics, Inc.  
Page 3 of 4  
XTC7004 - 4/4/11  
Reel Dimensions  
mm  
A
B
60  
C
D
E
F
G
H
T1  
9.0  
T2  
T3  
1.2  
Dimension  
Tolerance  
180  
±1.0  
13.0  
±0.2  
2.0  
9.1  
2.9  
4.9  
3.9  
11.4  
±1.0  
+1.0/-0.0  
±0.5  
±0.5  
±0.5  
±0.5  
±0.5  
±0.3  
±0.1  
Tape Dimensions  
mm  
A0  
B0  
W
F
E
P0  
P1  
P2  
D1  
D
K0  
t
Dimension  
2.80  
3.71  
8.00  
3.50  
1.75  
4.00  
4.00  
2.00  
1.50  
1.00  
1.75  
0.25  
Tolerance ±0.10 ±0.10 +0.30/-0.10 ±0.05 ±0.10 ±0.10 ±0.10 ±0.05 +0.10/-0.00 +0.25/-0.00 ±0.10 ±0.02  
www.RFM.com E-mail: info@rfm.com  
©2009-2011 by RF Monolithics, Inc.  
Page 4 of 4  
XTC7004 - 4/4/11  
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